WMSIC Electronic Components

Kingbright APTD1608LSECK/J4-PF

ModelAPTD1608LSECK/J4-PF
PackageSMD,1.6x0.8mm
BrandKingbright
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
Kingbright APTD1608LSECK/J4-PF
Type
KINGBRIGHT
Unit
Electronic Component
Minimum package
2000 圆盘

Technical parameters

Power
84mW
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
KINGBRIGHT
Electronic Component
APTD1608LSECK/J4-PF
Electronic Component
1
Package
SMD,1.6x0.8mm
Electronic Component
605nm
Electronic Component
LEDDiode / LED
Electronic Component
0.057g
Electronic Component
1
LED
150mcd
LED
60°
LED
Electronic Component
Electronic Component
BM0230856559
Electronic Component
611nm

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

APTD1608LSECK/J4-PF — Kingbright 橙色透明型 SMD LED 产品概述

一、产品概述

APTD1608LSECK/J4-PF 为 Kingbright 生产的橙色(Orange)表面贴装发光二极管,采用微型 SMD 封装(1.6 × 0.8 mm),透明无色透镜,视角 60°。凭借紧凑体积与良好的光学指向性,适合各种指示、背光与微型显示场景,特别适用于空间受限的消费电子与物联网终端。

二、主要参数

  • 发光颜色:橙色(Orange)
  • 峰值波长(λp):611 nm;典型波长:605 nm
  • 正向电压(Vf):1.8 V(典型)
  • 额定正向电流(If):2 mA(测试/典型驱动)
  • 发光强度:150 mcd(@ If = 2 mA)
  • 发光角度:60°
  • 封装尺寸:SMD 1.6 × 0.8 mm,透明透镜
  • 最大允许功率耗散:84 mW(器件功率限制)
  • 工作温度:-40 ℃ ~ +85 ℃

三、电气与光学特性要点

在典型驱动(If = 2 mA)条件下,Vf 约为 1.8 V,对应器件消耗功率约 3.6 mW(Vf × If),远小于其最大功率耗散 84 mW,说明器件在常用指示电流下热裕量充足。611 nm 的峰值波长决定了显著的橙色视觉效果,150 mcd 的亮度在低电流下已能提供清晰可见的指示效果。60° 的发光角适用于半指示、半聚光场合。

四、封装与安装建议

APTD1608LSECK/J4-PF 为微型 SMD 封装,便于高速贴片与回流焊装配。建议:

  • 参考 Kingbright 官方数据表的推荐 PCB 焊盘(Land Pattern)以保证良好焊接性与可靠的机械强度。
  • 贴片方向和极性需在丝印或装配程序中明确,避免翻转。
  • 回流焊温度应遵循无铅工艺规范与厂方建议,避免过高峰值温度与长时间温度暴露以保护透镜与芯片。

五、驱动与电路建议

为稳定驱动并延长寿命,应采用限流电阻或恒流驱动:

  • 限流电阻计算示例(以稳定 If = 2 mA 为例):
    • 3.3 V 电源:R ≈ (3.3 − 1.8) / 2 mA ≈ 750 Ω
    • 5 V 电源:R ≈ (5 − 1.8) / 2 mA ≈ 1.6 kΩ
  • 推荐在 MCU GPIO 直接驱动时使用上述限流元件,避免短时间电流浪涌。
  • 如需占空比亮度控制,优先使用 PWM 驱动,频率选择在可闻范围以外并保证平滑视觉感受。

六、可靠性与储存

  • 工作温度范围宽(-40 ℃ ~ +85 ℃),适合工业级环境;长期极端高温或高湿环境会加速老化,应按应用场景评估。
  • 芯片对静电敏感,建议在贴装与测试过程中采取防静电措施(ESD 保护手环、离子风等)。
  • 未开封时按厂方包装说明存放,潮气敏感元件(若适用)应按 J-STD-033 进行干燥处理与回流前的烘干。

七、典型应用

  • 面板指示灯、状态/故障指示
  • 可穿戴设备与便携仪器微型指示
  • 物联网终端与智能家电指示灯
  • 仪表盘与小型背光点阵

总结:APTD1608LSECK/J4-PF 在极小体积下提供稳定的橙色指示效果与良好可制造性,适合对尺寸、功耗与可见性有严格要求的产品。建议在设计阶段参考 Kingbright 官方规格书以获取完整的电气特性曲线、推荐焊盘与回流曲线,从而获得最佳的性能与可靠性表现。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.