WMSIC Electronic Components

Kingbright APG1608SURKC/T

ModelAPG1608SURKC/T
Package0603
BrandKingbright
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
Kingbright APG1608SURKC/T
Type
KINGBRIGHT
Unit
Electronic Component
Minimum package
4000 编带

Technical parameters

Power
75mW
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
KINGBRIGHT
Electronic Component
APG1608SURKC/T
Electronic Component
1
Package
0603
Electronic Component
630nm
Electronic Component
LEDDiode / LED
Electronic Component
0.024g
Electronic Component
1
LED
110mcd
LED
120°
LED
Electronic Component
Electronic Component
BM0229963338
Electronic Component
645nm

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

APG1608SURKC/T 产品概述 — Kingbright 红光 0603 LED

APG1608SURKC/T 是 Kingbright 小尺寸高亮度红光 LED(0603 / 1608公制封装),适用于微型指示、面板灯、可穿戴与消费电子等对体积与功耗有严格要求的场合。该器件采用透明无色透镜、发光角度宽、工作温度范围广,是常见的通用指示光源解决方案。

一 产品主要参数

  • 品牌:Kingbright
  • 型号:APG1608SURKC/T
  • 封装:0603(1608公制,典型外形约1.6 mm × 0.8 mm)
  • 发光颜色:红色
  • 透镜颜色:无色透明透镜(CLEAR)
  • 正向电流(If):典型 20 mA(最大额定电流请参考厂方数据表)
  • 正向压降(Vf):典型 2.0 V(在 If = 20 mA 条件下)
  • 最大功率耗散:75 mW(器件绝对最大值)
  • 工作功耗(在 If=20 mA 时):约 40 mW(Vf × If = 2.0 V × 0.02 A)
  • 波长(Dominant):630 nm
  • 峰值波长(λpeak):645 nm
  • 发光强度(Iv):110 mcd(通常在 If = 20 mA 测试条件下)
  • 发光角度:120°(半强度角)
  • 工作温度:-40 ℃ ~ +85 ℃

二 光学与电气特性说明

  • 波长与颜色:APG1608SURKC/T 的主导波长约 630 nm,属于典型的红色指示光,峰值在 645 nm,表示光谱在该波段有最高辐射强度。实际感知亮度受驱动电流、透镜和封装一致性影响。
  • 亮度与视角:110 mcd(20 mA)配合 120° 的发光角度,能在较宽视场内提供均匀的指示效果,适合面板、状态指示灯等应用。
  • 电气特性:在 20 mA 驱动下,器件耗电约 40 mW,远低于最大额定功率 75 mW。长期工作建议在额定条件内并适当留有裕量以延长寿命。

三 典型驱动与计算示例

一般以限流电阻与稳定电源驱动,计算方法如下(示例):

  • 若电源为 5 V,目标电流 20 mA:R = (Vcc − Vf) / If = (5.0 − 2.0) / 0.02 = 150 Ω
  • 限流电阻功耗:P_R = (Vcc − Vf) × If = 3.0 V × 0.02 A = 0.06 W(选择额定功耗 ≥ 0.125 W 更安全)

建议:

  • 若需延长使用寿命或降低功耗,可将驱动电流降到 2–10 mA 区间;亮度线性下降但更省电、热稳定性更好。
  • 使用 PWM 调光时频率 > 200 Hz 可避免可见闪烁,注意占空比对应平均电流与亮度关系。

四 封装与安装注意事项

  • 该器件为 0603 封装,焊接过程中需遵循制造商推荐的回流焊曲线,避免过高温度或过长时间暴露在高温下以免影响光衰与可靠性。
  • 建议在贴片工艺中采取合适的回流温度曲线(参照 Kingbright 数据手册),并在回流后给予充分冷却时间。
  • 由于体积小,搬运与贴装需防静电、避免机械应力与强挤压。

五 环境与可靠性

  • 工作温度范围宽(-40 ℃ 到 +85 ℃),适合多数室内与户外指示类应用。
  • 长期高温、高湿或大电流工作会加速光衰,建议设计时考虑热管理与电流裕量。
  • 储存时避免潮湿与高温,若已拆封置于吸湿盘中,按照湿敏等级与回流时间窗处理以防湿气引起封装开裂。

六 典型应用场景

  • 消费电子指示灯(遥控器、机顶盒、充电器等)
  • 工业与仪器面板状态指示
  • 小尺寸背光或点光源应用
  • 物联网终端、可穿戴设备与微型装置的指示照明

七 选型与采购建议

  • 在批量采购前建议获取 Kingbright 的完整数据手册并确认 Iv、Vf 的最小/典型/最大值及曲线特性。
  • 若关注更高亮度、不同波长或不同透镜类型,可参阅 Kingbright 系列中其它 0603/0805 等封装选项。
  • 设计样机阶段建议在目标电流与温度条件下做实际亮度与热测试,验证满足系统需求。

总之,APG1608SURKC/T 以其小尺寸、宽视角与稳定的红光输出,适合空间受限且需可靠指示光源的应用。详细电气与可靠性参数请以 Kingbright 官方数据表为准,并在设计中留有足够的电流与热裕量。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.