WMSIC Electronic Components

Kingbright KPG-1608ZGC

ModelKPG-1608ZGC
Package0603
BrandKingbright
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Kingbright KPG-1608ZGC
Type
KINGBRIGHT
Minimum package
4000 个

Technical parameters

Power
102.5mW
Electronic Component
Electronic Component
Electronic Component
KINGBRIGHT
Electronic Component
KPG-1608ZGC
Electronic Component
1
Package
0603
Electronic Component
525nm
Electronic Component
LEDDiode / LED
Electronic Component
0.033g
Electronic Component
1
LED
400mcd
LED
120°
LED
Electronic Component
Electronic Component
BM0257688532
Electronic Component
515nm
Operating Temperature
40℃~+85℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

KPG-1608ZGC — Kingbright 绿色 Chip LED 产品概述

一、产品简介

KPG-1608ZGC 是 Kingbright 旗下一款尺寸为 1.6 × 0.8 mm 的绿色 Chip LED,采用无色透明透镜设计,适合高密度表贴电路板的点光源需求。其典型发光波长在 515–525 nm 附近,光色纯正、显色稳定,适用于背光、指示与小型显示场景。

二、主要电气与光学参数

  • 发光颜色:绿色
  • 峰值波长:515 nm;典型波长:525 nm
  • 正向电流(If):20 mA(额定)
  • 正向压降(Vf):4.1 V(在 If=20 mA 条件下)
  • 功率:102.5 mW(标称)
  • 发光强度:约 400 mcd(If=20 mA 标准测量条件)
  • 发光角度:120°(半强度角)
  • 工作温度范围:-40 ℃ 至 +85 ℃

说明:上述光电参数为典型或标称值,具体设计时应参照 Kingbright 官方数据表并根据实际批次测试校正。

三、结构与封装特性

KPG-1608ZGC 为超小型 Chip LED,封装紧凑,透明透镜利于均匀出光。由于体积小,散热路径主要依赖焊盘与 PCB,焊接工艺(回流焊)与 PCB 散热设计会直接影响长期光衰与可靠性。建议按厂方推荐的焊盘布局和回流曲线进行工艺设计。

四、驱动与热管理建议

  • 推荐使用恒流驱动,常用工作电流不超过 20 mA;若需要更长寿命或更低光衰,建议降流使用或脉冲驱动并控制占空比。
  • 设计串联限流或恒流源,以防电流波动导致亮度差异或损坏。
  • 注意正向压降较高(约 4.1 V),在多并联时需考虑均流措施;在串联时需留足电源电压余量。
  • 小尺寸封装散热能力有限,应在 PCB 布局中提供适当铜箔散热并考虑热阻对光输出的影响。
  • 防止反向电压及静电击穿,必要时在驱动端加入反向保护元件与 ESD 防护。

五、典型应用场景

适用于便携式设备指示灯、仪表面板背光、通信设备状态指示、小尺寸显示模块以及要求空间密集布置的消费电子产品等对绿色指示或照明有要求的应用。

六、存储与可靠性注意事项

  • 储存时避免潮气和高温,建议使用干燥箱并遵循元器件湿敏等级(按厂方说明)。
  • 焊接前如为潮敏元件,请按回流前进行烘干处理以避免焊接时水汽爆裂。
  • 长期工作时应对温升进行监测并做电流降额,以延长使用寿命并减少光通量衰减。

如需具体封装尺寸、焊盘建议与详细电气光学曲线,请参考 Kingbright 官方数据手册或提供需求,我可以协助提取并给出 PCB 布局与驱动电路建议。

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