Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Kingbright KPTR-3216ZGC
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Kingbright KPTR-3216ZGC
- Type
- KINGBRIGHT
- Minimum package
- 2000 圆盘
Technical parameters
- Power
- 102.5mW
- Electronic Component
- Electronic Component
- Electronic Component
- KINGBRIGHT
- Electronic Component
- KPTR-3216ZGC
- Electronic Component
- 1
- Package
- 3216 (1206)
- Electronic Component
- 525nm
- Electronic Component
- LEDDiode / LED
- Electronic Component
- 0.059g
- Electronic Component
- 1
- LED
- 600mcd
- LED
- 140°
- LED
- Electronic Component
- Electronic Component
- BM0264480339
- Electronic Component
- 515nm
- Operating Temperature
- 40℃~+85℃
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
KPTR-3216ZGC 产品概述 — Kingbright 反装绿色贴片LED
一、概述
KPTR-3216ZGC 为 Kingbright 推出的反装（Reverse Mount）绿色贴片LED，封装尺寸为 3216（1206），外形尺寸约 3.2 × 1.6 × 1.05 mm。单颗独立二极管设计，透明无色透镜，发光面朝向 PCB，适合背光、面板指示和光导应用。
二、主要电气与光学参数
- 发光颜色：绿色
- 峰值波长（λpk）：515 nm，典型主波长：525 nm
- 正向电压（Vf）：4.1 V（典型，If = 20 mA）
- 额定正向电流（If）：20 mA
- 额定功率/耗散：标称 102.5 mW（说明：在推荐工作点 If=20 mA 时，实际电耗约为 Vf×If ≈ 82 mW；102.5 mW 可理解为器件最大耗散或规格表标注值，设计时以最大额定值和散热条件为准）
- 发光强度：600 mcd（典型，测量条件常为 If=20 mA）
- 发光角度：140°（宽视角）
- 透镜：透明无色（有利于光学耦合与光导设计）
三、机械与环境特性
- 封装：3216 (1206) SMD，小型扁平反装封装，便于高密度贴装与光学布线
- 外形尺寸：3.2 × 1.6 × 1.05 mm（典型）
- 工作温度范围：-40 ℃ 至 +85 ℃，适合一般工业级环境
- 二极管配置：独立单颗二极管，便于分组控制与布局
四、应用场景与优势
- PCB 反装布局可将光直接耦合至导光板或按键下方，常用于：背光模块、按键/面板指示、医疗设备指示灯、消费电子与物联网终端等。
- 宽视角（140°）利于均匀照明与可视性，不易产生光斑。
- 小型封装适合高密度 PCB 布局与精细光路设计。
五、设计建议与可靠性提示
- 驱动：建议采用恒流驱动或在电源侧加限流电阻以维持稳定 If=20 mA；如需更长寿命或更低发热，可降流使用（例如 5–10 mA）。
- 热管理：尽管功耗较低，但在密集贴片或高环境温度下应考虑散热路径，避免超出最大耗散。
- 焊接与工艺：遵循典型 SMD 回流工艺与厂家焊接建议，避免超温或长时间高温暴露以保证可靠性。
- 检验：在关键应用中建议进行光通量、色坐标和寿命测试以验证在目标条件下的表现。
以上为 KPTR-3216ZGC 的主要特性与应用建议，适用于需要小型反装绿色光源且要求宽视角与较高亮度的场合。若需更详细的电气特性曲线、绝对最大额定值或封装图纸，可参考 Kingbright 官方规格书或联系供应商获取完整数据手册。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
