WMSIC Electronic Components

Kingbright APTD2012LSYCK

ModelAPTD2012LSYCK
Package0805
BrandKingbright
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
Kingbright APTD2012LSYCK
Type
KINGBRIGHT
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Power
75mW
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
KINGBRIGHT
Electronic Component
APTD2012LSYCK
Electronic Component
1
Package
0805
Electronic Component
590nm
Electronic Component
LEDDiode / LED
Electronic Component
0.043g
Electronic Component
1
LED
90mcd
LED
40°
LED
Electronic Component
Electronic Component
BM0257629657
Electronic Component
590nm

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

Kingbright APTD2012LSYCK(黄色、透明透镜、0805)产品概述

APTD2012LSYCK 是 Kingbright 系列一款小型表面贴装黄色 LED,封装为常见的 0805(2012 公制)SMD。该器件以 590nm 峰值波长发出黄色光,透明透镜与 40° 发光角度结合,使其在指示、面板和背光等需要较好指向性和亮度的一体化应用中表现优异。其典型电性能与热性能适配低功耗系统,便于大规模 SMT 贴装与回流焊工艺。

一、主要规格速览

  • 发光颜色:黄色(Yellow)
  • 峰值波长(λp):590 nm
  • 正向电压(Vf):1.85 V(典型)
  • 正向电流(If):2 mA(额定)
  • 功率:75 mW(最大)
  • 发光强度:90 mcd(If = 2 mA,条件下典型值)
  • 发光角度:40°(典型)
  • 透镜:无色透明透镜
  • 工作温度范围:-40 ℃ 至 +85 ℃
  • 封装尺寸:0805 / 2012 公制(约 2.0 mm × 1.25 mm)

二、光电特性与驱动建议

在 If = 2 mA 条件下,器件可提供约 90 mcd 的亮度。由于 LED 属于电流驱动器件,建议使用恒流驱动或在串联限流电阻的情况下控制电流。常见限流电阻的计算方法:

  • 以 5 V 电源为例:R = (5.0 V − 1.85 V) / 2 mA ≈ 1.575 kΩ,建议取 1.5 kΩ 或 1.6 kΩ。
  • 以 3.3 V 电源为例:R = (3.3 V − 1.85 V) / 2 mA ≈ 725 Ω,建议取 720 Ω 或 750 Ω。 注意:驱动电流增大可提升亮度但会缩短寿命并增加热耗,且正向电压随温度变化,应留意热设计与限流裕量。

三、热与可靠性注意事项

  • 最大功耗 75 mW 意味着在 2 mA 工作点下实际耗散远低于额定极限(P ≈ 1.85 V × 2 mA ≈ 3.7 mW),温升较小,但在密集贴装或高环境温度下仍需考虑热累积。
  • 工作温度范围 -40 ℃至 +85 ℃,适合多数消费电子、仪表与工业面板用途,但不建议在超过温度极限的严苛环境长期使用。
  • LED 的光衰与寿命受驱动电流、环境温度及湿度影响,合理降流和良好散热可显著延长稳定发光期。

四、封装、贴装与焊接建议

  • 0805(2012)封装适合自动贴装(SMT)。推荐按照制造商提供的 PCB 焊盘尺寸及焊膏模板设计进行布局,以确保良好焊点和热传导。
  • 回流焊:建议遵循无铅回流曲线与厂家工艺指南,避免超过器件的极限峰值温度。
  • 清洗:可采用异丙醇等非腐蚀性溶剂清洗,避免使用强酸强碱溶剂。
  • 操作防护:LED 对 ESD 敏感,建议全程佩戴防静电手环并在 ESD 保护区内操作。

五、典型应用场景

  • 指示灯与状态指示(电源、通信、报警)
  • 仪表、面板与按键背光
  • 便携设备、家电与消费电子的视觉提示
  • 工业控制与医疗设备的低功耗指示场合

总结:APTD2012LSYCK 提供了小尺寸、低功耗且方向性好的黄色指示光源,适用于对空间、功耗和可视效果有要求的 SMT 应用场合。设计时注意合理限流、热管理与 ESD 防护,可获得稳定且长期的发光表现。若需更详细的电气特性曲线、推荐 PCB 尺寸或回流曲线,请参阅 Kingbright 官方数据手册。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.