WMSIC Electronic Components

Kingbright KP-1608ZGC

ModelKP-1608ZGC
Package0603
BrandKingbright
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Kingbright KP-1608ZGC
Type
KINGBRIGHT
Minimum package
2000 圆盘

Technical parameters

Power
102.5mW
Electronic Component
Electronic Component
Electronic Component
KINGBRIGHT
Electronic Component
KP-1608ZGC
Electronic Component
1
Package
0603
Electronic Component
525nm
Electronic Component
LEDDiode / LED
Electronic Component
0.037g
Electronic Component
1
LED
400mcd
LED
120°
LED
Electronic Component
Electronic Component
BM0265000775
Electronic Component
515nm
Operating Temperature
40℃~+85℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

KP-1608ZGC 产品概述

一、产品简介

KP-1608ZGC 为 Kingbright 生产的一款绿色 Chip LED,封装规格为 0603(尺寸 1.6 × 0.8 mm),单独二极管结构,采用无色透明透镜,整体体积极小、亮度集中、可靠性高,适合空间受限的表面贴装指示与背光应用。工作温度范围为 -40 ℃ ~ +85 ℃,适应一般消费与工业类环境。

二、光电特性

  • 发光颜色:绿色(峰值波长 515 nm,典型波长 525 nm)
  • 正向压降 (Vf):典型 4.1 V(If = 20 mA)
  • 额定正向电流:20 mA(最大)
  • 额定功耗:标注 102.5 mW(建议将此值视为器件最大耗散能力);典型工作时电功率约为 Vf × If ≈ 4.1 V × 20 mA = 82 mW
  • 发光强度:400 mcd(典型,测量条件通常为 If = 20 mA)
  • 发光角度:120° 说明:光学数值为典型值,实际出光受电流、驱动方式和封装、焊盘及散热条件影响,建议以厂方数据表中各工况下的曲线为准并进行样机验证。

三、典型应用

  • 面板与指示灯(仪表、家电、通信设备)
  • 按键/触摸背光与状态指示
  • 可穿戴与便携设备的微型指示
  • 仪器仪表、工业控制显示(需结合环境考核) 该器件以小尺寸和较宽视角见长,适用于要求短距离可视性且空间受限的场合。

四、设计与驱动建议

  • 驱动方式:建议恒流驱动或在串联限流电阻的恒压源下使用。最大正向电流为 20 mA,长期可靠性建议降额使用(常见 10–15 mA)。
  • 串联电阻计算示例(以 5 V 电源为例):R = (Vsupply − Vf) / If = (5.0 − 4.1) / 0.02 ≈ 45 Ω,电阻功率 P = I^2·R ≈ 0.018 W(选择 1/8 W 及以上安全裕度)。
  • 需注意:Vf ≈ 4.1 V,高于常见 3.3 V 单节供电,直接驱动需确认电源裕度或采用恒流源/升压电路。
  • 调光:支持 PWM 调光,频率需高于可见闪烁阈值(通常 >200 Hz),且在低占空比时注意色温与亮度线性变化。
  • 热管理:尽管功耗不高,但长期高电流会升高结温,建议保持 PCB 散热良好并采用适当当前降额策略。

五、封装与焊接注意

  • 推荐 PCB 焊盘设计参照 Kingbright 官方机械图,确保焊盘尺寸与阻焊开窗配合以获得良好焊点形貌。
  • 回流焊:遵循主流无铅回流曲线(厂家建议的峰值温度与时间以数据表为准,典型上限为 260 ℃ 左右的短时间峰值),避免重复高温暴露。
  • ESD 与静电防护:LED 对静电敏感,装配与测试过程需采取防静电措施(接地、腕带、防静电工作台等)。
  • 清洗:优选对有机溶剂和超声弱作用的清洗方式,避免化学品侵蚀封装。

六、可靠性与测试建议

  • 在量产前进行寿命(1000 h+)、高低温循环、湿热 (85/85) 与振动试验验证,评估在目标环境下的光衰与机械可靠性。
  • 推荐对批次进行光电参数抽样测试(Vf、Iv、发光强度、波长)以确认分档和一致性。

七、采购与资料

  • 建议在设计前索取并认真阅读 Kingbright 原厂数据表与封装图纸,确认分光/亮度档位(binning)、焊接工艺与包装方式。需要时向供应商咨询样品与长期供货的可用性与替代件信息。

如需具体的 PCB 焊盘建议图、回流曲线或按不同工作电流的光电特性曲线,可提供更详细的工程资料或协助选型验证。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.