WMSIC Electronic Components

Kingbright APTD1608SECK/J3-PF

ModelAPTD1608SECK/J3-PF
Package0603
BrandKingbright
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
Kingbright APTD1608SECK/J3-PF
Type
KINGBRIGHT
Unit
Electronic Component
Minimum package
2000 圆盘

Technical parameters

Power
84mW
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
KINGBRIGHT
Electronic Component
APTD1608SECK/J3-PF
Electronic Component
1
Package
0603
Electronic Component
625nm
Electronic Component
LEDDiode / LED
Electronic Component
0.059g
Electronic Component
1
LED
2.7cd
LED
60°
LED
Electronic Component
Electronic Component
BM0257377634
Electronic Component
640nm

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

APTD1608SECK/J3-PF 产品概述

一、产品简介

APTD1608SECK/J3-PF 是 Kingbright 推出的一款 0603 封装红色发光二极管(LED),透明无色透镜设计,适合作为面板指示、信号指示和小型光源应用。器件体积小、响应快、封装适配 SMT 贴装工艺,便于高密度电路板设计与自动化生产。

二、主要参数

  • 发光颜色:红色
  • 正向压降 (Vf):2.8 V(典型)
  • 正向电流 (If):20 mA(典型工作电流)
  • 功率(器件额定/耗散):84 mW(标称功率);按 Vf×If 计算的工作耗散约为 2.8V×20mA = 56 mW(实际工作耗散)。注:存在额定功率与瞬时功耗的差异,设计时请以厂家绝对最大额定值为准。
  • 峰值波长:640 nm;波长(主导/典型):625 nm
  • 发光强度:2700 mcd(在 20 mA 测试条件下)
  • 发光角度:60°(半强度角)
  • 透镜颜色:无色透明透镜
  • 工作温度范围:-40 ℃ ~ +85 ℃
  • 封装:0603(尺寸适合贴片工艺)
  • 品牌:Kingbright

三、光学与电气特性要点

该器件在 625 nm 附近为主观视觉较亮的红色,峰值出现在约 640 nm,适合做高对比度的指示灯。2700 mcd 的亮度在 0603 小封装中属较高等级,60° 的发光角度能在近距离提供集中、明显的点光源效果。典型正向压降 2.8 V 下,20 mA 工作时的实际耗散约 56 mW;若采用更高电流短时闪烁,应注意不超过器件额定功率 84 mW 及厂家规定的最大正向电流。

四、设计与使用建议

  • 限流电阻计算(例):
    • 在 3.3 V 驱动下:R ≈ (3.3 − 2.8) / 0.02 ≈ 25 Ω(可选 22–33 Ω)
    • 在 5 V 驱动下:R ≈ (5 − 2.8) / 0.02 ≈ 110 Ω(可选 110–120 Ω)
  • 热管理:虽然单颗耗散不大,但长期满流工作或密集布局时应考虑 PCB 散热与平均功率限制,避免器件温升导致亮度衰减或寿命下降。
  • 贴装与回流:适合 SMT 回流焊工艺。建议遵循 Kingbright 的回流焊曲线与焊接时间/温度限制(具体以厂家数据手册为准)。
  • 安装与测试:注意极性识别(阳极/阴极)。作业与测试时采取 ESD 防护措施,避免静电损伤。
  • 寿命与退化:LED 亮度会随时间和温度逐步衰减,建议按应用要求选用冗余或降低工作电流以延长寿命。

五、典型应用

  • 面板与设备状态指示灯
  • 消费类电子指示、按钮背光
  • 仪器仪表与通信设备指示
  • 工业控制面板与嵌入式系统的可见指示信号

六、注意事项与采购建议

在最终设计和量产前,请参照 Kingbright 官方数据手册核对所有关键参数(如最大允许正向电流、绝对最大功率、回流焊温度曲线、光电特性测试条件等)。若需环保/无铅或特殊筛选(如高亮、紧配色温分选),建议与供应商确认具体料号和放行证书。对于要求更高亮度或更宽视角的应用,可在同系列中比较不同发光强度与透镜类型的型号。

本概述基于典型参数与工程实践给出要点,供选型与设计参考。若需更详细的电学曲线、光谱分布或封装尺寸图,请索取 Kingbright 官方数据手册或联系供货商获取样品与测试报告。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.