WMSIC Electronic Components

Kingbright APTD1608LSECK/J3-PF

ModelAPTD1608LSECK/J3-PF
PackageSMD,1.6x0.8mm
BrandKingbright
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
Kingbright APTD1608LSECK/J3-PF
Type
KINGBRIGHT
Unit
Electronic Component
Minimum package
2000 圆盘

Technical parameters

Power
84mW
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
KINGBRIGHT
Electronic Component
APTD1608LSECK/J3-PF
Electronic Component
1
Package
SMD,1.6x0.8mm
Electronic Component
625nm
Electronic Component
LEDDiode / LED
Electronic Component
0.057g
Electronic Component
1
LED
60°
LED
Electronic Component
Electronic Component
BM0230661277
Electronic Component
640nm
Operating Temperature
40℃~+85℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

APTD1608LSECK/J3-PF 产品概述

一、产品简介

APTD1608LSECK/J3-PF 为 Kingbright 推出的高可靠性红色表面贴装发光二极管(SMD LED),采用 1.6 × 0.8 mm 微型封装,透明无色透镜,发光角度约 60°。该器件适合空间受限、指示显示或光点阵列等应用场景,兼顾小尺寸与稳定的光学性能。

二、主要参数

  • 发光颜色:红色
  • 波长(典型):625 nm,峰值波长 640 nm
  • 正向电压(Vf):约 1.8 V(典型值)
  • 正向电流(If):2 mA(额定)
  • 标称功率:84 mW(请以厂家数据表为准)
  • 透镜颜色:无色透明
  • 发光角度:60°
  • 工作温度范围:-40 ℃ 至 +85 ℃
  • 封装形式:SMD,尺寸 1.6 × 0.8 mm
  • 品牌:Kingbright

三、光学与电气特性

该器件在 2 mA 工作电流下可提供稳定的红色发射,峰值集中在 640 nm 附近,适合视觉指示与红光传感应用。典型正向电压约 1.8 V,实际值会随工艺与温度略有变化。使用时应通过限流电阻或恒流驱动器来稳定工作电流,避免过流导致器件降额或失效。

示例限流电阻计算:

  • 5 V 电源时:R = (5.0 − 1.8) / 0.002 ≈ 1.6 kΩ
  • 3.3 V 电源时:R = (3.3 − 1.8) / 0.002 ≈ 750 Ω
    以上为示例计算,设计时请考虑器件容差、温升及电源波动。

四、封装与机械特性

APTD1608LSECK/J3-PF 采用微型 1608(1.6 × 0.8 mm)SMD 封装,透明透镜利于均匀出光。小尺寸便于高密度布板和点阵化设计。建议参考 Kingbright 官方推荐的焊盘/封装图样以获得最佳光学与焊接性能。

五、典型应用场景

  • 面板/设备指示灯
  • 手机或可穿戴设备状态指示
  • 背光与信号提示(小尺寸阵列)
  • 工业仪表与消费电子产品的视觉提示

六、可靠性与注意事项

  • 温度范围:器件额定工作温度为 −40 ℃ 至 +85 ℃,长期在高温环境下会加速光衰与寿命衰减。
  • 湿热与焊接:建议遵循制造商的湿敏等级(MSL)和回流焊工艺要求,避免在焊接前受潮膨胀或吸湿。
  • ESD 防护:LED 对静电敏感,PCB 装配与测试时需采取防静电措施(佩戴接地腕带、使用 ESD 台面等)。
  • 驱动保护:避免超过额定正向电流与反向电压,反向电压过高可能损坏芯片。

七、推荐驱动与焊接工艺

  • 驱动:小电流场合可用限流电阻;需恒流输出或精确亮度控制时推荐使用恒流源或 PWM 驱动(注意 PWM 频率以避免可见闪烁)。
  • 回流焊:请参照 Kingbright 提供的回流曲线进行焊接,采用无铅工艺时控制峰值温度与时间,避免超温导致透镜变色或内部应力。
  • 焊盘与散热:尽管功耗较低,合理的焊盘设计有助于稳固贴装与散热稳定性。

八、合规与包装

APTD1608LSECK/J3-PF 通常为环保无铅(Pb‑Free)封装,具体合规性(如 RoHS)与包装形式请参考 Kingbright 官方数据资料与出货说明。终端设计与量产前,建议获取并核对最新的数据手册与样品进行验证。

如需更详细的电光参数曲线、推荐焊盘尺寸或回流焊曲线,我可以帮您整理 Kingbright 官方数据表中的关键信息。

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