Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Kingbright APT2012CGCK
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- Kingbright APT2012CGCK
- Type
- KINGBRIGHT
- Unit
- Electronic Component
- Minimum package
- 2000 编带
Technical parameters
- Power
- 75mW
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- KINGBRIGHT
- Electronic Component
- APT2012CGCK
- Electronic Component
- 1
- Package
- 0805
- Electronic Component
- 570nm
- Electronic Component
- LEDDiode / LED
- Electronic Component
- 0.038g
- Electronic Component
- 1
- LED
- 50mcd
- LED
- 140°
- LED
- Electronic Component
- Electronic Component
- BM0229963339
- Electronic Component
- 574nm
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
APT2012CGCK 产品概述
一、产品概述
APT2012CGCK 是 Kingbright 出品的 0805（2012 公制）表面贴装黄色绿色（黄绿）LED，透明无色透镜，呈现明亮均匀的荧光黄绿色光。芯片小巧、光通分布宽（发光角度 140°），适合要求空间受限但需大视角指示或背光的电子产品。工作温度范围宽（-40℃ 至 +85℃），可靠性适合工业及消费类应用。
二、主要参数
- 发光颜色：黄绿色（波长 570nm，峰值 574nm）
- 正向压降 Vf：2.1V（典型）
- 正向电流 If：20mA（最大额定工作电流）
- 功率限制：75mW（封装最大耗散功率）
- 发光强度：50mcd（@20mA）
- 发光角度：140°（广角）
- 透镜颜色：无色透明
- 工作温度：-40℃ ~ +85℃
- 封装：0805（2.0 × 1.25 mm）
- 品牌：Kingbright
三、电气与光学特性说明
在 20mA 时，器件典型 Vf 为 2.1V，对应耗散功率约 42mW（Vf×If），低于封装 75mW 的热极限，但长时高温或并联多颗时仍需注意热管理。50mcd 的亮度配合 140° 的视角，适用于可视指示或宽范围弱背光场合。峰值波长 574nm 属黄绿区域，肉眼亮度感知高，便于在强环境光下识别。
四、设计与使用建议
- 限流电阻计算：常见供电下建议阻值——5V 时 R ≈ (5−2.1)/0.02 ≈ 145Ω（取 150Ω）；3.3V 时 R ≈ (3.3−2.1)/0.02 ≈ 60Ω（取 62Ω）。
- 若需要更长寿命或高温环境，建议降低驱动电流至 10–15mA，可显著延长寿命并降低热应力。
- 并联多颗时每颗应单独限流或保证供电与电阻匹配，避免电流不均。
五、安装、回流与可靠性
APT2012CGCK 兼容无铅回流工艺。推荐遵循通用 LED 回流曲线（峰值温度视焊膏和板材而定，通常在 220–260℃ 范围内，严格参照厂商回流曲线）。装配时注意静电防护（ESD），存储和回流前避免受潮，必要时先进行烘烤脱湿。
六、包装与储存
常见卷带包装，便于贴片加工。为维持焊接可靠性，建议在出厂后规定时间内（依照防潮等级）完成回流，长期储存请置于干燥、防静电环境，避免阳光直射与高温潮湿。
七、典型应用
- 面板指示灯、状态指示
- 仪器仪表与工业控制指示
- 小型背光与按钮背光
- 消费电子指示（遥控器、充电器、玩具等）
总结：APT2012CGCK 以其小型封装、宽视角和高显著度黄绿色发光，适合空间受限且需良好可视性的指示与背光场合。合理限流与热管理可确保稳定可靠的长期工作。若需更详细的回流曲线或封装尺寸，请参阅 Kingbright 官方规格书。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
