WMSIC Electronic Components

Kingbright APT2012SGC

ModelAPT2012SGC
Package0805
BrandKingbright
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
Kingbright APT2012SGC
Type
KINGBRIGHT
Unit
Electronic Component
Minimum package
2000 编带

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
KINGBRIGHT
Electronic Component
APT2012SGC
Electronic Component
1
Package
0805
Electronic Component
568nm
Electronic Component
LEDDiode / LED
Electronic Component
0.037g
Electronic Component
1
LED
12mcd
LED
160°
LED
Electronic Component
Electronic Component
BM0229963356
Electronic Component
565nm

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

APT2012SGC 产品概述

一、产品简介

APT2012SGC 为 Kingbright 生产的一款 0805 封装翠绿色贴片 LED(GREEN CLEAR CHIP)。该器件采用无色透明透镜,发光色泽为翠绿色(峰值波长565nm,典型波长568nm),属于高视角、低功耗的指示类光源,适合各种需窄体积、高可靠性的电子产品指示和背光场合。

二、主要电学与光学参数

  • 发光颜色:翠绿色(Peak 565nm / 波长 568nm)
  • 正向电压 Vf(典型):2.2V
  • 驱动电流 If(最大/典型):20mA(建议工作电流)
  • 功率:62.5mW(器件最大耗散功率)
  • 发光强度:12mcd(典型)
  • 发光角度:160°(宽视角)
  • 透镜颜色:无色透明

这些参数表明 APT2012SGC 在 20mA 驱动下能提供稳定的中等亮度输出,宽视角适合面光或指示灯均匀可视要求。

三、封装与环境适应

  • 封装:0805(约 2.0 × 1.25 mm),适配常见 SMT 贴装流程
  • 工作温度范围:-40℃ ~ +85℃,适合工业级使用环境

小体积便于高密度 PCB 布局,宽温域保证在多数工业和消费类产品中的可靠性。

四、典型应用场景

  • 仪表和面板指示灯
  • 家用电器与消费电子指示/状态显示
  • 通讯设备与网络设备状态指示
  • 小型背光及装饰照明
  • 可穿戴与便携设备的标识灯

五、使用建议与注意事项

  • 驱动与限流:推荐恒流驱动或在电源侧使用限流电阻。举例:若用 5V 电源,R ≈ (5V − 2.2V) / 20mA ≈ 140Ω(常取 150Ω);若用 3.3V,R ≈ (3.3V − 2.2V) / 20mA ≈ 55Ω(常取 56Ω)。为延长寿命,建议在 10~15mA 区间运行以降低热应力。
  • 回流焊:建议采用无铅回流工艺,控制峰值温度与时间(常见参考值峰值约 245~260℃,短时峰值)。具体请参照厂商焊接规范。
  • 散热与热管理:尽量保证 PCB 有足够铜箔面积及焊盘,以利热量扩散,避免长期在高温下满载工作。
  • 静电防护:LED 对静电敏感,贴片与手工操作时注意 ESD 防护。
  • 存储与湿敏:按厂家湿敏等级保存,避免湿气引起焊接问题。

六、结论

APT2012SGC 以其小体积(0805)、翠绿色光色和宽广视角(160°)成为通用型指示与背光方案的优秀选择。适当的驱动电流和良好的 PCB 散热设计可确保长期稳定发光,广泛适用于消费电子、通信设备及工业控制面板等场合。如需更详细的电气/机械图纸或回流焊规范,建议参阅 Kingbright 官方规格书或联系供应商获取原厂资料。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.