WMSIC Electronic Components

Kingbright KPTR-3216SYCK

ModelKPTR-3216SYCK
Package1206
BrandKingbright
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Kingbright KPTR-3216SYCK
Type
KINGBRIGHT
Minimum package
2000 圆盘

Technical parameters

Power
75mW
Electronic Component
Electronic Component
Electronic Component
KINGBRIGHT
Electronic Component
KPTR-3216SYCK
Electronic Component
1
Package
1206
Electronic Component
590nm
Electronic Component
LEDDiode / LED
Electronic Component
0.062g
Electronic Component
1
LED
150mcd
LED
140°
LED
Electronic Component
Electronic Component
BM0230586386
Electronic Component
590nm
Operating Temperature
40℃~+85℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

KPTR-3216SYCK 产品概述

一、产品简介

KPTR-3216SYCK 为 Kingbright 出品的反向贴装黄色发光二极管(Reverse Mount LED),采用 1206(3216)封装设计。发光颜色为黄色,峰值波长 590nm,透镜为无色透明,发光角度宽达 140°,适用于需要广角指示或背照式导光应用的电子设备。工作温度范围 -40℃ 至 +85℃,可满足工业级温度要求。

二、主要电光参数

  • 正向电流(If):20mA(典型推荐驱动电流)
  • 正向压降(Vf):2.5V(在推荐电流下)
  • 最大功率耗散:75mW(器件额定功率,请参考热管理)
  • 光强:150mcd(在 20mA 时)
  • 峰值波长:590nm(黄色/琥珀光)
    上述参数适用于典型驱动条件,实际电气及光学表现会随驱动电流、温度与封装热阻变化。

三、封装与安装特性

KPTR-3216SYCK 属于 1206(3216)SMD 规格,采用反向贴装结构(Reverse Mount),即发光面朝向 PCB 板面或特定导光结构的一侧设计,便于采用背光、键盘指示或通过光导槽传输光线的低矮结构。SMD 封装利于自动贴装与回流焊流程,需按制造商推荐的焊盘尺寸与回流工艺参数进行焊接以保证可靠性。

四、应用场景

  • 面板与键盘背光、状态指示
  • 低矮或盲孔导光应用(使用光导管/光纤)
  • 工业仪表与控制面板指示
  • 消费电子的微型指示灯与信号标示

五、设计与使用建议

  1. 电流限制:推荐使用限流电阻或恒流驱动器控制 If=20mA;举例:5V 供电时 R≈(5.0-2.5)/0.02≈125Ω(可选 120Ω/130Ω);3.3V 供电时 R≈(3.3-2.5)/0.02≈40Ω(可选 39Ω/47Ω)。
  2. 功率与散热:器件额定功耗 75mW,实际电耗约 Vf×If(2.5V×20mA≈50mW);在高温环境中应适当降额使用以延长寿命。
  3. 焊接工艺:遵循 SMD 回流焊通用规范,避免过长高温暴露与迅速冷却导致应力;回流后建议进行外观与电性检查。
  4. 防静电:LED 对静电敏感,装配与测试阶段应做好 ESD 防护。
  5. 光学控制:150mcd 与 140° 大角度适合广域可见性,但若需方向性强光或透镜聚光,需配合外部光学件设计。

六、可靠性与测试

在产品开发与量产前,建议进行温度漂移、光强随时间衰减、焊接耐受性及振动/冲击测试,验证在目标应用环境下的稳定性。对长期使用场景,应考虑在高温或高湿环境下的降额策略与防护措施。

如需进一步的封装图、焊盘推荐尺寸或完整电光特性曲线(I-V、光强-电流、光强-角度等),可联系供应商或参考 Kingbright 数据手册以获得原厂详细资料。

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