WMSIC Electronic Components

Kingbright APA3010F3C-GX

ModelAPA3010F3C-GX
PackageSMD
BrandKingbright
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
Kingbright APA3010F3C-GX
Type
KINGBRIGHT
Unit
Electronic Component
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
KINGBRIGHT
Electronic Component
APA3010F3C-GX
Electronic Component
1
Package
SMD
Electronic Component
940nm
Electronic Component
Infrared Emitter
Electronic Component
160°
Electronic Component
0.065g
Electronic Component
50nm
Electronic Component
1
Electronic Component
BM0230027276
Operating Temperature
40℃~+85℃
Current
50mA
Electronic Component
1.2mW/sr@IF=20mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

APA3010F3C-GX 红外发射二极管(Kingbright)产品概述

一、产品概述

APA3010F3C-GX 是 Kingbright 提供的一款表面贴装型红外发射二极管(IR emitter),中心波长为 940 nm,面向短距离到中距离的红外照明与信号发送应用。该器件在 20 mA 驱动下可提供较高的辐射强度,同时采用宽视角封装(约 160°),便于覆盖较大视野区域,适合接近传感、物体检测、红外遥控与夜视补光等场景。

二、主要参数

  • 型号:APA3010F3C-GX(Kingbright,SMD)
  • 中心波长(λ):940 nm
  • 半波宽(FWHM):50 nm
  • 正向压降(Vf):约 1.2 V(典型)
  • 正向电流(If):50 mA(最大额定)
  • 推荐测量点:辐射强度 1.2 mW/sr @ 20 mA
  • 耗散功率(Pd):90 mW
  • 直流反向耐压(Vr):5 V
  • 视角(全角):约 160°
  • 工作温度范围:-40 ℃ 至 +85 ℃

三、光电性能说明

  • 在 20 mA 驱动下,典型辐射强度为 1.2 mW/sr,可用于驱动光电接收器或作为主动红外光源。
  • 中心波长 940 nm 与常见的硅或 InGaAs 接收器匹配良好;光谱半峰宽约 50 nm,选择接收器时应考虑光谱响应特性以提高系统效率。
  • 宽视角(约 160°)意味着光束分布较为均匀,适合需要大面积照明或减少对准精度要求的应用;若需远距离或聚焦照明,应选择窄角器件或配合光学透镜。

四、典型应用场景

  • 红外遥控发射(与接收端匹配滤波与接收器)
  • 接近/避障传感(智能家电、机器人、无人机)
  • 夜视/可见光不可见补光(安防摄像、监控)
  • 光电对射/光栅传感器中的发射源
  • 数据红外通信(短距离点对点)

五、使用建议

  • 推荐工作点:为了获得稳定寿命与可靠性,常用 20 mA 作为参考驱动电流;50 mA 为器件极限(请尽量避免持续满额定驱动)。
  • 驱动方式:优先使用恒流驱动器以确保输出稳定并防止热失控;若用电阻限流,需按 R = (Vsup - Vf) / I 计算并考虑电压波动与容差。
  • 示例电阻计算(参考):5 V 电源、目标 If=20 mA → R = (5 - 1.2) / 0.02 ≈ 190 Ω(取常见值 180–200 Ω);3.3 V 电源、If=20 mA → R ≈ 105 Ω(可取 100–120 Ω)。
  • 热管理:尽管为 SMD 封装,仍需关注焊盘散热与 PCB 铜层以控制结温;在高占空比或连续工作场合下应做降额(derating)。

六、封装与贴装注意

  • SMD 封装便于自动化贴装与回流焊生产。建议按照厂商提供的 PCB 尺寸与焊盘推荐图进行设计,以保证光轴位置与散热性能。
  • 回流焊接:遵循 Kingbright 的回流焊温度曲线和湿度敏感等级(MSL)说明,避免超出制造商推荐的峰值温度与时长。
  • 存储与防潮:SMD LED 对水汽敏感,长时间暴露可能导致焊接时基材起泡;建议干燥储存并在规定时间内回流焊。

七、可靠性与环境条件

  • 工作温度范围 -40 ℃ 到 +85 ℃,适应宽温区工业环境。高温下应对光输出与寿命作相应降额设计。
  • ESD 防护:发射二极管对静电敏感,生产与测试环节须采取静电防护(佩戴接地手环、使用防静电工作台等)。
  • 逆向电压限制:反向电压最大 5 V,应避免在电路中承受反向冲击或过压。

八、选型与系统集成提示

  • 若系统需求以最大辐射强度或远距离照射为主,应优先关注额定 If 与包装角度;窄角器件配合光学透镜能有效提升远距离能量密度。
  • 接收端光谱响应需与 940 nm 波长匹配,若要减小环境光干扰,可配合窄带滤光片或脉冲编码与同步解调技术。
  • 在高温或高占空比应用中,建议通过实验测定结温与光衰曲线并据此制定驱动与散热方案。

总结:APA3010F3C-GX 以 940 nm 波段、宽视角与 SMD 形式为核心特征,适合多种短中距离红外应用。合理的恒流驱动、良好的热管理与遵循封装贴装规范是保证其稳定输出与长期可靠性的关键。若需更详细的封装图、焊盘尺寸或回流曲线,请参考 Kingbright 官方数据手册。

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