WMSIC Electronic Components

Kingbright APTF1616LSEEZGKQBKC

ModelAPTF1616LSEEZGKQBKC
PackageSMD-4P,1.6x1.6mm
BrandKingbright
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
Kingbright APTF1616LSEEZGKQBKC
Type
KINGBRIGHT
Unit
Electronic Component
Minimum package
2000 编带

Technical parameters

Power
G:102.5mW;R:75mW;B:120mW
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
KINGBRIGHT
Electronic Component
APTF1616LSEEZGKQBKC
Electronic Component
1
Electronic Component
1.6mm
Package
SMD-4P,1.6x1.6mm
Electronic Component
B:465nm;R:621nm;G:525nm
Electronic Component
RGB LED
Electronic Component
0.033g
Electronic Component
1.6mm
Electronic Component
0.7mm
Electronic Component
1
LED
G:50mcd;R:15mcd;B:14mcd
LED
120°

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

APTF1616LSEEZGKQBKC — Kingbright RGB 透明面光 SMD (1.6×1.6mm) 产品概述

一、产品概述

APTF1616LSEEZGKQBKC 为 Kingbright 出品的共阳极 RGB 贴片发光二极管,封装为 SMD-4P,外形尺寸 1.6 × 1.6 × 0.7 mm,采用无色透明透镜,发光角度 120°。该器件在小尺寸、高密度布板场合有良好可见性与配色控制能力,适合指示、微型面光源及便携类设备点阵显示等应用。

二、主要光学与电气参数

  • 颜色与波长(名义/峰值):红 (R) 621 nm / 630 nm;绿 (G) 525 nm / 515 nm;蓝 (B) 465 nm / 460 nm。
  • 发光强度(典型):G 50 mcd;R 15 mcd;B 14 mcd(测试条件请参照厂方标准)。
  • 正向压降 Vf:R 1.8–2.1 V;G 2.65–3.1 V;B 2.65–3.1 V。
  • 功率:G 102.5 mW;R 75 mW;B 120 mW。
  • 发光角度:120°(宽视角,便于扩展视野)。
  • 工作温度范围:−40 ℃ 至 +85 ℃。

三、封装与引脚配置

  • 封装:SMD-4P,共阳极(Common Anode)。
  • 外形尺寸:长 1.6 mm、宽 1.6 mm、高 0.7 mm,适配 1.6×1.6 mm 封装焊盘布局。
  • 透明透镜利于纯色与双色混合时的颜色还原与透过率。

四、驱动与电气设计建议

  • 该器件为共阳极结构,常用驱动方式为将阳极接至正电源,使用限流电阻或下侧开关(例如 NPN/ N‑MOS)分别控制 R、G、B 灯脚。
  • 限流电阻计算公式:R = (Vcc − Vf) / I。根据应用可选择合适驱动电流(小型贴片常见工作电流 5–20 mA,具体请根据亮度与功耗权衡)。
  • 由于各色 Vf 与功耗不同,驱动时需单独计算并合理设计耐流与散热。

五、焊接、安装与静电防护

  • 推荐采用无铅回流焊工艺,遵循器件厂商的回流温度曲线以避免过热应力。
  • 器件尺寸小,贴装时建议使用精细 PCB 焊盘与对应尺寸的锡膏模板以保证焊点可靠性。
  • 抗静电能力(典型):R 3000 V;B 250 V;G 450 V。实际装配过程中应采取常规 ESD 保护措施(防静电手环、离子风机、接地作业台等),特别注意蓝绿色单元对静电敏感性较高。

六、典型应用

  • 小型状态指示与多色提示灯(消费电子、智能家居)。
  • 背光与装饰照明(按钮、微型面光源)。
  • 可穿戴设备、手持终端、IoT 设备的色彩提示与信号显示。
  • 微型点阵或矩阵显示单元。

七、选型建议与注意事项

  • 若对亮度均匀性或特定色温有严格要求,请在样件阶段进行实际测量并根据 Vf、mcd 数据调整驱动电流。
  • 关注蓝色与绿色单元的 Vf 与功率差异,避免单一电源及限流设计导致颜色不均或过驱。
  • 在高环境温度或密集布局场合评估热量累积对寿命与亮度的影响。
  • 量产前建议向 Kingbright 索取完整数据手册与回流焊曲线,以获得更精确的可靠性与测试规范。

如需我提供常见驱动电路示例、PCB 封装建议或者基于您电源电压的限流电阻计算,请告知目标 Vcc 与期望驱动电流,我将给出具体参数与参考布局建议。

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