WMSIC Electronic Components

Kingbright KPHCM-2012CGCK

ModelKPHCM-2012CGCK
Package0805
BrandKingbright
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Kingbright KPHCM-2012CGCK
Type
KINGBRIGHT
Minimum package
2000 圆盘

Technical parameters

Power
75mW
Electronic Component
Electronic Component
Electronic Component
KINGBRIGHT
Electronic Component
KPHCM-2012CGCK
Electronic Component
1
Package
0805
Electronic Component
570nm
Electronic Component
LEDDiode / LED
Electronic Component
0.035g
Electronic Component
1
LED
50mcd
LED
110°
LED
Electronic Component
Electronic Component
BM0265591094
Electronic Component
574nm
Operating Temperature
40℃~+85℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

Kingbright KPHCM-2012CGCK黄绿色Chip LED产品概述

一、核心基础参数总览

KPHCM-2012CGCK是Kingbright推出的小型化Chip型LED,核心参数适配低功耗、高集成度应用场景:

  • 发光颜色:黄绿色
  • 电气核心:正向电流20mA、正向压降2.5V(典型)、额定功率75mW
  • 光学核心:波长570nm、峰值波长574nm、发光强度50mcd、发光角度110°
  • 环境适应性:工作温度-40℃~+85℃

二、封装与物理形态

该产品采用Chip型无引脚封装(或简化引脚设计),尺寸为2.0mm×1.25mm(长×宽),属于微型化设计,可直接贴装在PCB上,支持高密度集成(如小间距显示模组)。透镜选用无色透明材质,既保证光线高透过率,又避免透镜对光色的干扰,确保输出光色纯净。

三、光学性能表现

3.1 光色与光谱特性

发光颜色为黄绿色,中心波长570nm、峰值波长574nm——该波长区间落在人眼对黄绿色的敏感峰值附近,视觉辨识度远高于普通指示灯。无色透明透镜无滤光作用,输出光色与芯片原生光色一致,无偏黄/偏绿风险。

3.2 发光强度与视角

额定发光强度50mcd,在20mA正向电流下可提供清晰可见的指示效果(即使在中等亮度环境中);发光角度110°(半强度角),属于宽视角设计——在45°侧面观察时,光强仍保持最大值的50%以上,适合多人或多角度观察场景(如公共设备面板)。

四、电气特性详解

4.1 正向导通特性

  • 正向压降(Vf):典型值2.5V,额定电流下偏差范围±0.2V(参考datasheet),属于同类黄绿色LED的常规水平,与常用MCU/驱动电路兼容性好。
  • 正向电流(If):额定值20mA,是长期可靠工作的推荐电流;最大允许电流需参考官方文档,但额定功率75mW表明器件有一定过载余量(2.5V×20mA=50mW,远低于75mW)。

4.2 功率与可靠性

额定功率75mW,确保正常工作时无过热风险;Kingbright采用的封装工艺(如芯片键合、电极防护)可降低长期光衰速率,符合工业级产品的可靠性要求(典型光衰:1000小时后<10%)。

五、环境适应性

工作温度范围覆盖**-40℃至+85℃**,满足多场景需求:

  • 低温场景:如北方户外设备、低温存储仪器的指示灯;
  • 高温场景:如工业车间(夏季高温)、车载中控(车内高温环境)的辅助指示;
  • 无需额外散热/温度补偿,简化系统设计成本。

六、典型应用场景

结合小型化、宽温性及黄绿色辨识度优势,该产品适用于:

  1. 小型电子设备指示灯:智能家居控制器、便携医疗仪器(如血糖仪)、智能手环的状态提示;
  2. 工业控制面板:PLC、变频器、传感器模块的运行/故障指示;
  3. 消费电子:蓝牙耳机、智能音箱的充电/连接状态灯;
  4. 车载电子:仪表盘辅助指示灯、车载导航的小尺寸提示灯(符合宽温要求);
  5. 低功耗显示模组:小型字符显示(如7段显示)、点阵显示的单元像素(高密度集成)。

七、产品优势总结

  1. 微型化集成:2.0mm×1.25mm Chip封装,适配小间距PCB布局;
  2. 宽温可靠:-40℃~+85℃工作范围,覆盖工业/户外/车载场景;
  3. 清晰可见:110°宽视角+50mcd强度,多角度辨识度高;
  4. 低功耗:20mA电流+2.5V压降,典型功耗仅50mW,适配电池供电设备;
  5. 品牌保障:Kingbright成熟工艺,长期光衰低,质量稳定。

该产品可直接替换同类Chip型LED,无需调整电路参数,是小型指示/显示场景的高性价比选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.