WMSIC Electronic Components

KUU 0603L010YR

Model0603L010YR
Package0603
BrandKUU
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
KUU 0603L010YR
Type
KUU
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
KUU
Electronic Component
0603L010YR
Electronic Component
1
Electronic Component
1.05mm
Package
0603
Electronic Component
Resettable Fuse
Electronic Component
0.018g
Electronic Component
1.85mm
Electronic Component
1mm
Electronic Component
1
Electronic Component
1s
Electronic Component
BM0234575822
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
15V
Power(Pd)
500mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0603L010YR 产品概述

一、产品简介

0603L010YR 是 KUU 品牌的一款微型自恢复过流保护器件(PPTC/复合式自恢复保险),采用 0603(1.85 mm × 1.05 mm × 1.00 mm)表面贴装封装,面向低电压、低功耗电子系统的过流保护需求。产品在过流时能迅速上升阻值以限制电流,故障清除后自动冷却恢复初始阻值,便于重复使用,适合对体积和成本敏感的便携与嵌入式产品。

二、主要电气参数

  • 额定耐压(Vmax):15 V(最大工作电压,应不超过此值)
  • 最大承受电流(Imax):35 A(短时冲击或短路条件下的极限值)
  • 保持电流(Ihold):100 mA(器件在常温下可长期通过而不动作的最大电流)
  • 跳闸电流(Itrip):300 mA(器件在常温下会在一定时间内动作的过流阈值)
  • 功率消耗/允许耗散(Pd):500 mW(最大耗散功率,设计时需参考)
  • 初始态阻值(Rmin):900 mΩ(典型冷态接触电阻,约 0.9 Ω)
  • 跳断后阻值(R1max):6 Ω(动作后器件阻值上升的最大值,用于限制故障电流)
  • 动作时间:1 s(在标称过流条件下的指示动作时间)

注:PPTC 的动作时间与过流倍数、环境温度和散热条件密切相关,标称值为典型参考值。

三、热与机械特性

  • 工作温度范围:-40 ℃ ~ +85 ℃(适应工业级至商业级环境)
  • 封装尺寸:长度 1.85 mm,宽度 1.05 mm,高度 1.00 mm(符合 0603 贴片尺寸)
  • 小尺寸设计利于高密度 PCB 布局,但对焊接工艺和热管理有一定要求。

四、典型应用场景

  • USB、串口、I/O 接口和信号线的过流保护(低电压、低电流)
  • 可穿戴设备、智能传感器、便携式仪器的电源分支保护
  • 电池供电模块、单板计算模块(如 MCU 电源输入)的小电流保护
  • 消费电子、物联网终端和工业控制中对体积和自动恢复能力有要求的场合

基于 Ihold=100 mA、Itrip=300 mA 的参数,最适合保护涓流至数百毫安级的电路,不适用作大电流供电主电源的长期保护。

五、设计与选型建议

  • 电压限制:系统工作电压应小于或等于 15 V,超过时需选用更高耐压的器件或并用外部保护元件。
  • 热管理与散热:在高环境温度或紧凑空间内,器件的实际保持电流和跳闸电流会下降,建议按需求适当留有裕量并避开热源。
  • 开关特性:若电路存在瞬时浪涌或启动电流,需确保该脉冲不触发器件动作,否则考虑更高 Ihold 规格或在前端加入限流元件。
  • 短路承受:Imax=35 A 表示短时冲击承受能力,但该条件下器件将迅速加热并动作,设计时不应将其作为常态电流参考。
  • 测量考量:测量实际电阻时应避免长时间大电流通过,以免器件进入高阻态影响数据。

六、封装与安装

  • 0603 封装兼容常见 SMT 贴装与回流焊工艺。推荐采用标准回流焊温度曲线,避免过度加热导致性能变化。
  • 布局时建议将器件靠近需保护的输入端放置,并保证良好散热路径与 solder pad 面积以提升热释放效果。
  • 机械强度:避免在板上受力或在焊接后强行弯曲,防止封装损伤影响可靠性。

七、可靠性与测试建议

  • 建议在实际应用中对器件进行全温度工况测试(包括高温、低温启动与过流触发测试),验证 Ihold/Itrip 在工作环境下的稳定性。
  • 长期可靠性测试(如高温老化、热循环)有助于评估在实际产品寿命周期中的性能漂移。
  • 对于关键保护点,建议与其他保护元件(如 TVS、熔断器)配合使用以实现多重保护策略。

八、注意事项与维护

  • 切勿超过 15 V 的最大工作电压,避免电压击穿或异常升温。
  • 若频繁触发跳闸,应排查下游负载或短路原因,不建议通过重复动作掩盖设计问题。
  • 存储和使用时避免潮湿与强腐蚀性气氛,防止焊盘或端子氧化影响电性连接。

总结:0603L010YR 以其微小体积、自动复位特性以及适合百毫安级保护的电气参数,适合嵌入式、便携与接口保护场合。但在应用时需关注工作电压、热管理和环境对 Ihold/Itrip 的影响,合理选型与 PCB 布局能够发挥其最佳保护性能。

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