WMSIC Electronic Components

KUU SMF3.3A

ModelSMF3.3A
PackageSOD-123
BrandKUU
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
KUU SMF3.3A
Type
KUU
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
KUU
Electronic Component
SMF3.3A
Electronic Component
1
Package
SOD-123
Electronic Component
Electronic Component
Type
TVS
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.038g
Electronic Component
1
Electronic Component
BM0231142799
Operating Temperature
55℃~+150℃
Voltage
8V
Current(Ir)
400uA
Voltage(VBR)
5.2V
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMF3.3A(KUU)产品概述

一、产品简介

SMF3.3A 是 KUU 品牌的一款单向瞬态电压抑制二极管(TVS),以 SOD-123 表面贴装封装提供,专为对 3.3V 直流供电线及信号线的浪涌/静电瞬变保护而设计。器件具有较低的反向截止电压(Vrwm = 3.3V),在瞬态发生时能够迅速进入导通状态,将过电压钳位于允许范围内(典型钳位电压 8V),从而保护下游电路元件免受损害。器件耐受峰值脉冲电流 25A 和峰值脉冲功率 200W,工作温度范围宽(-55℃ ~ +150℃),适合多种工业与民用电子应用。

二、主要电气参数与意义

  • 极性:单向(Uni-directional)
    适用于以地为参考的正向瞬变抑制,推荐将阴极(带极环一侧)接至被保护电源/信号线,阳极接地。
  • 反向截止电压(Vrwm):3.3V
    表示在正常工作条件下器件的最大耐受电压,适配常见 3.3V 电源系统。
  • 击穿电压(Vbr):5.2V
    器件进入雪崩击穿并开始限制电压的起始电压区间,保证在超出 Vrwm 后迅速钳位。
  • 钳位电压(Vclamp):8V(典型)
    在峰值冲击时对电压的最大限制值,关键参数决定被保护器件的安全性。
  • 峰值脉冲电流(Ipp):25A
    器件能承受的瞬态峰值电流能力,用于评价抗浪涌能力。
  • 峰值脉冲功率(Ppp):200W
    在指定的短时脉冲条件下器件可耗散的最大瞬时功率。
  • 反向漏电流(Ir):400 μA
    在 Vrwm 附近的静态漏电水平,需在低功耗或高阻抗电路中考虑其影响。
  • 工作温度:-55℃ ~ +150℃
    适用于较宽温度环境,可靠性高。
  • 封装:SOD-123
    小型表贴,适合空间受限的 PCB 布局与自动化贴装。

三、典型应用场景

  • 3.3V 电源轨防护:为 MCU、FPGA、SoC 等敏感芯片提供浪涌与静电保护。
  • 接口保护:I/O 接口、串行总线或外部连接器处对瞬态过压的抑制。
  • 工业控制设备:宽温度范围和较高脉冲能力使其适用于工业环境的瞬态防护。
  • 消费电子与通信设备:在 USB 子系统、无线模块电源供给与射频前端保护等场合提供辅助防护。

四、布局与使用建议

  • 引脚连接:单向 TVS 的阴极(通常在封装上有标记)连接至被保护线路,阳极连接至地。
  • 接地处理:为发挥最佳保护效果,应将 TVS 的地端尽量通过短且粗的铜箔接至公共地;对于高能量脉冲,建议在附近布置多点过孔与地层连接以降低回路阻抗。
  • 布局距离:将 TVS 尽可能靠近受保护的接口或电源输入端放置,缩短走线以减小寄生电感带来的钳位电压上升。
  • 并联与选型:在需要更高能量吸收时,可并联多个 TVS,但需注意热均衡与钳位一致性;若对漏电流或钳位电压有更严格要求,可选用漏电更低或更低 Vclamp 的型号。

五、可靠性与热管理

  • 功率与冲击:200W 的峰值脉冲功率与 25A 的峰值脉冲电流表明器件能承受短时高能冲击;在频繁浪涌或较长脉冲情况下应采用外部限流(如保险丝、阻尼元件)或选型更高能量器件以避免过热失效。
  • 工作温度:-55℃ ~ +150℃ 的范围适合多数严苛环境,但长期接近上限运行会加速老化,设计时建议留有裕量。
  • 焊接与装配:采用 SOD-123 封装,符合常规表面贴装工艺,装配时应遵循制造商的回流焊温度曲线与焊接建议,以避免热应力损伤。

六、选型与注意事项

  • 钳位电压与被保护元件耐压:钳位电压 8V(典型)对 3.3V 系统来说能提供有效防护,但若被保护元件的最大耐压低于此值需谨慎。
  • 漏电流考量:400 μA 的反向漏电相对较高,在低功耗或精密模拟前端需评估其影响,必要时可选漏电更低的型号。
  • 验证测试:在最终设计中应进行实际浪涌与 ESD 测试(考虑实际连接线寄生、接地方式等),以验证保护效果并调整 PCB 布局或增加保护级数。

结论:SMF3.3A(KUU,SOD-123)是一款针对 3.3V 系统的单向 TVS 器件,具有良好的瞬态吸收能力与宽温度适应性,适用于一般工业与消费电子的瞬态保护需求。在实际应用中,应结合具体系统的耐压、漏电、热管理和 PCB 布局进行综合评估与验证,以保证长期可靠的保护效果。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.