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KUU BSS138
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- KUU BSS138
- Type
- KUU
- Minimum package
- 3000 编带
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- KUU
- Electronic Component
- BSS138
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- 1 N
- Type
- N
- Electronic Component
- MOSFET
- Electronic Component
- 0.032g
- Electronic Component
- 1
- Electronic Component
- BM0264342982
- Operating Temperature
- 55℃~+150℃
- Power Dissipation(Pd)
- 225mW
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Voltage(Vdss)
- 50V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
KUU BSS138 产品概述
一、产品简介
KUU BSS138 是一款低功耗、小封装的 N 沟道增强型 MOSFET，封装为 SOT-23。该器件额定漏源电压 Vdss 为 50V，连续漏极电流 Id 为 220mA，适合低电流开关与信号传输场合。典型导通电阻 RDS(on) 为 6Ω（Vgs=4.5V），耗散功率 Pd=225mW，门限电压 Vgs(th)≈1.6V。器件输入电容 Ciss≈50pF，输出电容 Coss≈25pF，工作温度范围 -55℃ 至 +150℃。
二、主要参数速览
- 类型：N 沟道 MOSFET（增强型）
- 封装：SOT-23（单只）
- Vdss：50V
- 连续 Id：220mA
- RDS(on)：6Ω @ Vgs=4.5V
- Pd：225mW
- Vgs(th)：约 1.6V
- Ciss：≈50pF；Coss：≈25pF
- 工作温度：-55℃ ~ +150℃
三、特点与优势
- 低电容：较小的输入/输出电容使开关与传输响应快，适合高速信号切换；
- 小封装：SOT-23 体积小，便于在空间受限的板上布局；
- 宽电压裕量：50V 的耐压适合多数工业与消费电子中的中低压场合；
- 低门限：Vgs(th)≈1.6V，方便与低电压逻辑电平配合驱动。
四、典型应用场景
- MCU 与低电平逻辑的电平转换（双向或单向）；
- 小电流负载开关与信号路由；
- 接口保护、电源管理中的旁路/隔离开关；
- 便携设备、传感器前端及低功耗电路。
五、使用建议与注意事项
- 功率限值：Pd 为 225mW，持续工作时需注意器件结温上升并做热量管理，必要时加大铜箔面积作为散热；
- 导通电阻较高：RDS(on)=6Ω 在大电流场合会造成显著压降与发热，故不建议驱动较大负载；
- 驱动电压：若需降低 RDS(on)，尽量使用较高门极驱动电压（但不能超过器件最大 Vgs 额定）；
- 布局：关键信号线尽量短、靠近返流地，门极加小阻抗（几十欧姆）可抑制振铃；在开关环路中并联适当的驱动/吸收元件以减少过冲。
六、引脚与封装提示
SOT-23 常见引脚排列为：Pin1 Gate，Pin2 Drain，Pin3 Source（在设计时请参考 KUU 提供的具体封装图纸以确认引脚顺序）。生产与焊接过程中注意温度曲线以保护封装与内部结构。
七、总结
KUU BSS138 在 SOT-23 小型封装中提供了 50V 耐压与低电容特性，适合低功耗、低电流的开关与信号处理应用。合理的电路设计与热管理可以充分发挥其在体积受限应用中的优势。如需用于较大电流或持续高功耗场合，建议选用更大功率、低 RDS(on) 的 MOSFET。若需完整数据手册与封装图，请向供应商索取 KUU 官方资料。
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