WMSIC Electronic Components

KUU ESD5Z3V3

ModelESD5Z3V3
PackageSOD-523
BrandKUU
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
KUU ESD5Z3V3
Type
KUU
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
KUU
Electronic Component
ESD5Z3V3
Electronic Component
1
Package
SOD-523
Electronic Component
Electronic Component
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.026g
Electronic Component
1
Channel Count
Electronic Component
Cj- Capacitor
105pF
Electronic Component
BM0264356201
Operating Temperature
55℃~+125℃
Voltage
14V
Electronic Component
IEC 61000-4-2

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ESD5Z3V3(KUU)产品概述

一、产品简介

ESD5Z3V3 系列为 KUU 提供的一款单路单向静电放电保护器件,封装为超小型 SOD-523。该器件专为保护对电压敏感的信号线或接口(尤其是 3.3V 供电/信号系统)免受静电放电(ESD)和短时瞬态过电压冲击而设计,具有响应速度快、钳位能力好、泄漏电流低和占板面积小的特点,适合手机、便携式设备、数码相机、电源模块等空间受限的终端产品。

二、关键电气参数

  • 极性:单向
  • 反向截止电压 Vrwm:3.3 V(适用于 3.3V 信号/电源保护)
  • 击穿电压 VBR:5 V
  • 钳位电压(典型/峰值):14 V(ESD 能量时的钳位能力)
  • 峰值脉冲电流 Ipp(8/20μs):7.5 A
  • 峰值脉冲功率 Ppp(8/20μs):105 W
  • 反向漏电流 Ir:900 nA(在 Vrwm 条件下,低泄漏)
  • 结电容 Cj:105 pF(对高频/高速信号有一定影响)
  • 通道数:单路
  • 工作温度:-55 ℃ ~ +125 ℃
  • 防护等级:符合 IEC 61000-4-2 标准(ESD 防护)
  • 封装:SOD-523

三、主要特点

  • 小体积封装(SOD-523),节省 PCB 布局空间;
  • 钳位电压约 14 V,可有效吸收人体放电等瞬态能量,保护下游 IC;
  • 低漏电流(900 nA),适合对静态功耗敏感的便携式设备;
  • 响应时间极快,能够在静电事件发生的瞬间夹断尖峰;
  • 单路、单向结构便于用于单端信号或电源线保护。

四、典型应用场景

  • 手机与移动终端的外部接口(USB、耳机、SIM 卡槽等);
  • 便携式数码相机、可穿戴设备的数据/信号线保护;
  • 3.3V 逻辑电平信号线、I/O 口、微控制器输入保护;
  • 小型电源模块及外围电路的瞬态抑制;
  • 任何空间受限且需满足 IEC 61000-4-2 ESD 要求的消费电子产品。

五、使用与布局建议

  • 器件应尽量靠近被保护的接口或连接器放置,保证从入侵点到器件的走线最短;
  • 将器件的地端通过低阻抗、短距的回流路径接地,如使用一颗靠近的地 via,以提升能量散逸能力;
  • 对于高速差分/串行总线,需注意 105 pF 的结电容可能引起信号完整性影响,必要时进行仿真或选择低电容替代品;
  • 对于需要保护较大能量的电源轨,建议与线性或瞬态保护器(TVS)配合使用,ESD5Z3V3 更适合信号线或轻量级瞬态防护。

六、限制与注意事项

  • 钳位电压 14 V 对多数 ESD 冲击有效,但不适合作为高能雷击或持续过压场景的主防护器件;
  • 结电容 105 pF 在高频或高速差分信号上可能引入插入损耗或时序误差,设计时需评估;
  • 器件额定峰值脉冲电流 7.5 A(8/20μs)为单次脉冲能力,多次重复高能事件可能导致性能退化或失效。

七、产品选型与订购信息

  • 型号:ESD5Z3V3
  • 品牌:KUU
  • 封装:SOD-523
  • 适用场景:3.3V 信号保护、便携消费电子设备 ESD 防护
    选型时请结合系统的工作电压、允许的钳位电压以及信号带宽要求。如需样品或大批量采购,请向 KUU 或授权经销商索取器件数据表与可靠性测试报告,确认封装与焊接工艺兼容。

如需我提供典型等效电路图、PCB 布局示意或与同类低电容/高功率 TVS 的对比建议,可继续说明应用场景与具体需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.