WMSIC Electronic Components

KUU K0805L020/30AR

ModelK0805L020/30AR
Package0805
BrandKUU
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
KUU K0805L020/30AR
Type
KUU
Minimum package
3500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
KUU
Electronic Component
K0805L020/30AR
Electronic Component
1
Electronic Component
1.5mm
Package
0805
Electronic Component
Resettable Fuse
Electronic Component
0.03g
Electronic Component
2.3mm
Electronic Component
1mm
Electronic Component
1
Electronic Component
20ms
Electronic Component
BM0264548736
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
30V
Power(Pd)
600mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

K0805L020/30AR 产品概述

一、产品简介

K0805L020/30AR 为KUU品牌0805封装的复位型自恢复保险器(PTC),适用于对小电流过流保护要求严格的便携式与板载电子设备。器件在正常工作电流下阻值低、损耗小;在过流时迅速升温增阻,实现断路保护,故障解除后自动恢复。

二、主要规格参数

  • 额定耐压(Vmax):30 V
  • 最大允许冲击电流(Imax):100 A(短时冲击承受能力)
  • 保持电流(Ihold):200 mA(正常不动作的最大电流)
  • 跳闸电流(Itrip):500 mA(典型动作电流)
  • 额定功耗(Pd):600 mW
  • 初始态阻值(Rmin):500 mΩ(0.5 Ω)
  • 跳断后最大阻值(R1max):3.2 Ω
  • 动作时间:20 ms(典型)
  • 工作温度:-40 ℃ ~ +85 ℃
  • 外形尺寸:长度2.3 mm × 宽度1.5 mm × 高度1.0 mm
  • 封装:0805(SMD)

三、性能与特性

  • 快速响应:典型动作时间约20 ms,能在短时间内限制过流并保护后级电路。
  • 可复位:故障解除并冷却后阻值恢复,适合重复保护场景,降低维护成本。
  • 低初始阻抗:0.5 Ω 初始阻值在小电流应用中减少压降与功耗。
  • 强瞬态耐受:可承受高达100 A的短时冲击电流(用于吸收器件或突发性浪涌),需在实际电路中注意能量限制。

四、典型应用场景

  • USB、音视频接口与外设供电保护
  • 移动电源、便携设备和电池管理的短路/过流保护
  • 家用电子、嵌入式模块及物联网终端的板级保护
  • LED 驱动与小功率电源保护

五、封装与安装

0805 标准贴片封装,建议按常规 0805 焊盘设计进行回流焊装配。器件的热阻与周边铜箔面积有关,较大铜箔有助于散热与稳定保持电流值。工作温度范围适合大多数商业及工业级应用。

六、使用建议与选型要点

  • 区分 Ihold 与 Itrip,实际选型时应保证工作电流远低于 Ihold,以避免误动作。
  • 对有大浪涌或启动电流的负载,需验证器件的冲击能力与热容,必要时并联限流或使用前级熔断器。
  • 注意环境温度对保持/动作电流的影响,温度越高器件越容易动作,应参考温度-电流曲线。
  • 评估初始压降与功耗(Pd),以确认长期运行下的热稳定性。

七、可靠性与测试

建议在目标应用中完成过流/循环测试、温升测试与回流焊工艺可靠性验证。对于关键应用,依据相关标准(如 IEC/UL 类规范)开展认证与寿命评估。

八、包装与订购

K0805L020/30AR 为标准卷带包装(卷盘贴片),适配自动贴片机。下单时请确认所需数量、交期及是否需特殊品控或认证报告。对于对浪涌或连续高负载敏感的设计,可与厂方技术支持沟通获取更详尽的I–T、I–V曲线数据。

如需器件的完整电气特性曲线(I–T、I–V、温度影响曲线)或参考焊盘布局建议,我可继续提供。

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