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KUU MMBT3904
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- KUU MMBT3904
- Type
- KUU
- Minimum package
- 3000 编带
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- KUU
- Electronic Component
- MMBT3904
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- 1 NPN
- Electronic Component
- Transistor(BJT)
- Electronic Component
- 0.036g
- Electronic Component
- 1
- Electronic Component
- BM0231142808
- Transistor Type
- NPN
- Frequency(f T)
- 300MHz
- Power Dissipation(Pd)
- 200mW
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Collector Current(Ic)
- 200mA
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MMBT3904 (KUU) — SOT-23 封装 NPN 三极管产品概述
一、产品简介
MMBT3904 是一款通用小信号 NPN 晶体管，KUU 品牌的 SOT-23 封装版本针对表面贴装应用进行了优化。该器件具有较高的增益和频率特性，适合用于放大、开关及高频小信号处理场合。器件额定集电极电流可达 200mA，集电极-射极击穿电压 40V，适用范围广泛且便于自动化贴装。
二、主要参数
- 晶体管类型：NPN（BJT）
- 封装：SOT-23（小型表面贴装）
- 直流电流增益 hFE：100（测试条件 Ic=10mA，Vce=1V）
- 集电极电流 Ic(max)：200mA
- 集电极-射极击穿电压 Vceo：40V
- 集电极截止电流 Icbo：1μA（典型）
- 特征频率 fT：300MHz（用于评估高频放大能力）
- 功耗 Pd：200mW（封装和散热条件相关）
- 射基极击穿电压 Vebo：6V（请勿反向超过此值）
- 集射极饱和电压 VCE(sat)：约 300mV（视测试条件而定）
三、性能特点
- 增益稳定：在中低电流工作点（如 10mA）下 hFE ≈100，便于设计偏置电路与放大级。
- 高频能力好：fT≈300MHz，适合高频小信号放大器或推动级应用。
- 低漏电：Icbo 低至 1μA，静态漏电小，有利于低功耗电路。
- 小体积高集成度：SOT-23 封装兼顾体积和自动化装配性能，适合便携或密集板级布局。
四、典型应用
- 小信号放大：前置放大器、音频放大器的小信号级。
- 快速开关：驱动小型继电器、LED，或作为逻辑电平开关。
- 高频电路：射频前端、混频或本地振荡器的低噪声放大级（需结合电路仿真）。
- 通用电子电路：传感器接口、信号整形与缓冲等场合。
五、使用建议与注意事项
- 功耗管理：SOT-23 的 Pd 约 200mW，实际可承受能量受 PCB 散热和环境温度影响。高电流或连续功耗场合应考虑降低功耗或加大铜箔散热。
- 基极反向电压：Vebo 为 6V，切勿在应用中使基极-射极承受反向电压超过该值，以免永久损伤。
- 饱和区与开关速度：在要求快速切换时，避免过度进入深饱和状态（可通过增加基极电阻或并联肖特基钳位改善恢复时间）。
- 设计余量：实际应用中建议留有安全裕量，不长期工作在最大额定值附近，以延长可靠性与寿命。
- 噪声与偏置：高频放大时关注偏置点与输入匹配，必要时配合退耦电容和阻抗匹配网络使用。
六、封装与可靠性
SOT-23 小封装利于自动贴装与高密度 PCB 布局，但散热能力有限，适合低功耗或间歇性工作的场合。出货前建议参照厂家完整数据手册进行温度系数、极限参数以及封装尺寸的确认，以保证在具体应用中的可靠性与可制造性。
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