WMSIC Electronic Components

KUU SS56

ModelSS56
PackageSMA
BrandKUU
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
KUU SS56
Type
KUU
Minimum package
5000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
KUU
Electronic Component
SS56
Electronic Component
1
Package
SMA
Electronic Component
Schottky Diode
Electronic Component
0.349g
Electronic Component
1
Electronic Component
BM0264873495
Current
5A
Diode
Electronic Component
Current(Ir)
500uA@60V
(Vf)
700mV@5A
Electronic Component
50℃~+150℃
Electronic Component
Electronic Component
Electronic Component
5000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SS56 产品概述

一、产品简介

SS56 是 KUU 品牌的一款独立式肖特基整流二极管,封装为 SMA,面向中功率整流与保护应用。该器件在 5A 工作电流点的正向压降为 0.7V,具有较高的浪涌承受能力(非重复峰值浪涌电流 Ifsm = 150A),并在最高反向电压 60V 下保持工作稳定,是一款性价比较高的通用肖特基整流二极管。

二、主要参数

  • 二极管类型:肖特基(独立式)
  • 正向压降(Vf):0.7V @ 5A
  • 直流反向耐压(Vr):60V
  • 平均整流电流:5A
  • 反向漏电流(Ir):500µA @ 60V
  • 非重复峰值浪涌电流(Ifsm):150A
  • 工作结温范围:-50℃ ~ +150℃
  • 品牌:KUU
  • 封装:SMA

三、器件优势

  • 低正向压降:在 5A 工作点 Vf = 0.7V,可降低整流损耗、提高效率,适合需要较低损耗的电源线路。
  • 快速响应:肖特基结构无显著反向恢复特性,适合开关电源与快速切换场合,能有效抑制开关损耗与噪声。
  • 高浪涌能力:Ifsm = 150A,能承受电源开机或短时过载产生的冲击电流,提高系统鲁棒性。
  • 宽温度范围:-50℃ 至 +150℃ 的结温适用性,适应工业级环境要求。
  • 封装便捷:SMA 表面贴装形式,便于自动化贴装和小型化电路设计。

四、典型应用场景

  • 开关电源(SMPS)输出整流或续流二极管
  • DC-DC 降压/升压转换器中的整流与保护
  • 逆接保护、电池充放电方向控制与 OR-ing 电路
  • 适配器、充电器、LED 驱动(在电压和热条件允许下)
  • 汽车电子 12V/24V 辅助电路(需注意最高 60V 的反向耐压限制)

五、封装与热管理建议

  • SMA 封装热阻较金属封装高,5A 连续整流时需关注 PCB 散热:建议增大铜箔面积、使用散热过孔并靠近散热边缘布局。
  • 在高环境温度或连续高电流工况下,应预留电流降额裕度,避免长时间靠近结温上限。
  • 反向漏电流随温度上升显著增加,工作在高温、高压点时需评估泄漏对系统的影响。

六、使用注意事项

  • 反向电压不得超过 60V;长期接近额定 Vr 或在高温下工作会导致漏电流增加。
  • 在高浪涌场合,注意 Ifsm 与实际波形(半波整流或脉冲宽度)匹配,必要时增加浪涌吸收元件。
  • 推荐在设计阶段参考实际 PCB 环境进行热仿真与试验验证,以确定安全的持续电流与降额方案。

七、结论

KUU SS56(SMA 封装)是一款面向中功率应用的肖特基整流二极管,具备低正向压降(0.7V@5A)、高浪涌承受能力(150A)及工业级的工作温度范围,适合开关电源整流、续流保护与一般整流场合。合理的 PCB 散热与温度管理是其在高电流应用中获得长期可靠性的关键。若用于关键或高温场景,建议在样机阶段进行充分的热与电气测试验证。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.