Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
KUU KRU30L30M3
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- KUU KRU30L30M3
- Type
- KUU
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- KUU
- Electronic Component
- KRU30L30M3
- Electronic Component
- 1
- Package
- PDFN-8L(3x3)
- Electronic Component
- 1 P
- Type
- P
- Electronic Component
- MOSFET
- Electronic Component
- 0.08g
- Electronic Component
- 1
- Electronic Component
- BM0264342993
- Power Dissipation(Pd)
- 35W
- Electronic Component
- Electronic Component
- Electronic Component
- 5000
- Voltage(Vdss)
- 30V
- Capacitor(Ciss)
- 2.15nF
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
KRU30L30M3 产品概述
一、主要参数
KRU30L30M3 为 KUU 品牌 P 沟道功率 MOSFET，主要电气参数如下：额定漏源电压 Vdss = 30V；连续漏极电流 Id = 35A；导通电阻 RDS(on) = 10.5 mΩ（@ Vgs = 20V）；耗散功率 Pd = 35W；栅阈电压 Vgs(th) ≈ 2.8V；总栅极电荷 Qg = 40.3 nC（@10V）；输入电容 Ciss = 2.15 nF，反向传输电容 Crss = 245 pF。封装为 PDFN-8L (3×3)。
二、器件特性与优势
- 低导通电阻与高电流承载能力（10.5 mΩ / 35A）适合高效率电源路径需求。
- 30V 额定电压覆盖常见 12V 与 24V 系统的高侧开关与保护场景。
- PDFN-8L 小型封装兼顾面积与热性能，便于高密度 PCB 布局。
三、驱动与开关考量
- 栅极电荷 Qg 较大（40.3 nC@10V），要求驱动器具备足够驱动电流以实现快速切换，长栅驱动时间会增加开关损耗。
- 标称 RDS(on) 在 Vgs=20V 时测得；实际设计中若驱动电压受限（例如仅 -10V），导通电阻会增加，应在电路仿真或样品测量中验证。
四、热管理与封装建议
- Pd = 35W 表明在高功耗条件下需良好散热：推荐使用较大散热铜箔、底部过孔或外部散热片以降低结到环境热阻。
- PDFN-8L (3×3) 要注意焊盘设计与热焊盘的焊锡填充，保证热流向 PCB 内层散布。
五、典型应用场景
- 高侧开关与电源路径控制（汽车电子、工业电源、笔记本/便携设备）
- 反向连接保护、负载断开以及同步整流场景
- 电池管理与充放电切换（适用于 12V/24V 电池系统）
六、设计注意事项
- 对于高频切换，请权衡导通损耗与开关损耗，必要时采用驱动缓冲或阻尼网络以抑制振铃。
- 若用于高侧开关，确认系统可提供足够的门极驱动幅值（P 沟道栅压通常为负向相对于源极），并留出安全裕量以避免误导通。
- 在布局上尽量缩短漏源回流路径、加大散热铜面积并安排热过孔以提升可靠性。
结论：KRU30L30M3 以其低 RDS(on)、高电流能力与紧凑封装，适合 12V/24V 电源管理与高侧开关应用，但因较高栅极电荷与对驱动电压的敏感性，在高速或受限驱动电压条件下需做好驱动与热设计验证。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
