WMSIC Electronic Components

KUU K1210L200/8AR

ModelK1210L200/8AR
Package1210
BrandKUU
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
KUU K1210L200/8AR
Type
KUU
Minimum package
3500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
KUU
Electronic Component
K1210L200/8AR
Electronic Component
1
Electronic Component
2.8mm
Package
1210
Electronic Component
Resettable Fuse
Electronic Component
0.035g
Electronic Component
3.43mm
Electronic Component
1mm
Electronic Component
1
Electronic Component
1s
Electronic Component
BM0264548727
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
8V
Power(Pd)
700mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

K1210L200/8AR 产品概述

一、产品简介

K1210L200/8AR 是 KUU 品牌、1210 封装的一款低压高电流自恢复保险元件(PPTC 类似器件),针对 5V 及以下或小于 8V 的直流供电线路设计。器件体积小、响应快速,适用于电源保护和短路/过流自恢复场合。

二、主要电气参数

  • 最大耐压 (Vmax):8 V
  • 最大通过电流 (Imax):40 A(短时过载能力)
  • 保持电流 (Ihold):2 A(器件在正常工作时能长期承载的电流)
  • 跳闸电流 (Itrip):4 A(典型触发过流使阻值明显上升的电流)
  • 功耗 (Pd):700 mW
  • 初始态阻值 (Rmin):20 mΩ(冷态低阻)
  • 跳断后阻值 (R1max):90 mΩ(过流后进入高阻态)
  • 动作时间:1 s(在 Itrip 条件下典型动作时间)
  • 工作温度范围:-40 ℃~+85 ℃

三、主要特性与优势

  • 小尺寸高密度:1210 封装(长 3.43 mm × 宽 2.8 mm × 高 1 mm),便于表面贴装和高密度布局。
  • 快速响应:在指定过流条件下 1 s 级动作,能有效限制短路能量。
  • 自恢复:过流消除后阻值恢复,免去更换熔断器的成本与维护。
  • 低初始电阻:20 mΩ 级低阻,适合需要较小压降的供电母线。
  • 适用低压领域:最大耐压 8 V,适配 5 V 系统、锂电池单节保护及 USB 等接口保护。

四、典型应用场景

  • USB 供电和周边保护(USB-A/USB-C 5 V 线路)
  • 便携式设备电源管理(单节锂电池或低压模块)
  • 摄像头、路由器、物联网终端等低压 DC 设备的过流保护
  • 模块化电源输入保护和短路限流场合

五、使用建议与注意事项

  • 选型时保持 Ihold 高于正常工作电流,Itrip 低于可能造成损伤的短路电流。
  • 由于 Pd=700 mW,器件在高环境温度或紧凑布局下的散热受限会影响动作性能,应留足铜箔和空气流通来降低温升。
  • 最大耐压 8 V,勿用于超过该电压的系统。
  • 焊接和回流工艺需参照材料兼容性,建议在首批样机上验证焊接可靠性与热循环寿命。
  • 长期工作环境超过规格温度时性能会下降,应做充分降额设计。

六、封装与机械尺寸

  • 封装:1210(SMD)
  • 尺寸:长 3.43 mm × 宽 2.8 mm × 高 1 mm,适配常见 1210 贴片焊盘布局,便于自动贴装与回流焊工艺。

七、可靠性与测试建议

  • 进行过流触发测试、重复动作寿命测试以及热循环试验以验证在目标产品环境下的稳定性。
  • 在样机阶段测试不同 PCB 铜箔面积和周边元件对器件温度的影响,确定最终布局与散热策略。
  • 对于关键应用,建议留取冗余保护措施或配合限流元件共同使用,以提高系统整体可靠性。

如需完整规格书、典型波形和推荐 PCB 尺寸图,请联系 KUU 或供应商索取详细数据手册。

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