WMSIC Electronic Components

KUU K1206L010AR

ModelK1206L010AR
Package1206
BrandKUU
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
KUU K1206L010AR
Type
KUU
Minimum package
3500 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
KUU
Electronic Component
K1206L010AR
Electronic Component
1
Electronic Component
1.8mm
Package
1206
Electronic Component
Resettable Fuse
Electronic Component
0.03g
Electronic Component
3.4mm
Electronic Component
1.2mm
Electronic Component
1
Electronic Component
1.2s
Electronic Component
BM0258756620
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
30V
Power(Pd)
400mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

K1206L010AR 产品概述

K1206L010AR 是 KUU 品牌的一款 1206 封装自恢复熔断器(PPTC),用于对过流和短路故障提供自动限流保护。器件在正常工作时阻值较低,在过流时迅速增大阻抗限制电流,故障消除并冷却后能自动恢复导通状态,适合便携消费电子、接口保护和板级电源防护应用。

一、主要电气与机械参数

  • 额定耐压(Vmax):30 V(最大允许工作电压)
  • 最大承受电流(Imax):10 A(短时冲击或非持续峰值)
  • 保持电流(Ihold):100 mA(器件在正常温度下连续不动作的最大电流)
  • 跳闸电流(Itrip):250 mA(在规定时间内开始进入高阻态的参考电流)
  • 最大功耗(Pd):400 mW(额定功耗指标,设计时需考虑热量散逸)
  • 初始态阻值(Rmin):1.4 Ω(冷态或正常工作时的典型低阻)
  • 跳断后阻值(R1max):15 Ω(热动作后阻值上限,用于抑制故障电流)
  • 动作时间:1.2 s(在达到 Itrip 条件下的参考动作时间)
  • 工作温度范围:-40 ℃ ~ +85 ℃
  • 外形尺寸(L×W×H):3.4 mm × 1.8 mm × 1.2 mm(1206 SMT 封装)

二、工作原理与性能特点

K1206L010AR 属于聚合物正温度系数(PPTC)自恢复熔断器。当电流超过保持电流并达到或超过跳闸电流时,器件内部温升导致导电聚合物材料电阻急剧上升,从而限制通过电流并保护电路。故障消除后,器件冷却恢复低阻态,实现自动复位。其主要特点包括:

  • 小尺寸(1206)便于表面贴装与高密度 PCB 布局;
  • 快速动作(参考 1.2 s)可有效限制短路持续时间;
  • 重复自恢复能力,适合频繁的瞬态或间歇故障场景;
  • 低温漂和宽工作温度范围,适应多种环境。

三、典型应用场景

  • USB、电源和数据接口过流保护;
  • 移动电源与电池管理系统的短路保护;
  • 消费电子(路由器、机顶盒、监控摄像机等)板级电源防护;
  • 工业控制和仪表的局部保护电路;
  • 任何需在空间受限处实现自动复位过流保护的场合。

四、选型与使用建议

  • 选择器件时,连续工作电流应低于 Ihold(100 mA),并保留安全裕量;若正常电流接近 Ihold,应上调规格或并联负载并评估热效应;
  • Imax(10 A)通常指短时冲击能力,不代表可长时间通过的电流;对重复浪涌或高能冲击需做额外热分析与寿命验证;
  • 受环境温度影响,Ihold 与 Itrip 会发生变化;高温环境下器件更容易触发,应进行温度下的实测验证;
  • 设计 PCB 时注意散热路径与焊盘尺寸,确保 Pd 及热量能有效传导至基板以避免误动作;
  • 严格遵守最大工作电压 30 V 限制,超过此电压可能导致器件失效或不可靠动作。

五、封装与安装注意

K1206L010AR 为标准 1206 SMT 封装(3.4 × 1.8 × 1.2 mm),兼容常规贴片工艺与回流焊。建议遵循制造商的 PCB 焊盘建议和回流温度曲线(若需高温环境装配,请先确认器件耐焊性)。安装时保持周围无强烈热源且避免直接覆盖高耗热元器件,以减少误动作概率。

六、局限与可靠性提示

  • 自恢复熔断器并非精密限流器,对长期精确电流控制不适合;
  • 在高能短路或长时间过流下,器件可能达到耐受极限,需考虑额外保护(例如保险丝或限流电阻);
  • 对于关键安全电路,建议采用冗余保护或配合其他保护元件共同使用。

K1206L010AR 以其紧凑封装、自动复位特性和明确的电气参数,适合对小电流线路进行可靠的过流保护。在设计阶段请结合实际工作电流、环境温度及峰值冲击要求进行充分验证,以确保产品长期稳定运行。若需封装图、焊盘建议或环境下的电流-时间曲线测试数据,可联系供应商获取更详尽的验证资料。

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