WMSIC Electronic Components

KUU K1210L050YR

ModelK1210L050YR
Package1210
BrandKUU
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
KUU K1210L050YR
Type
KUU
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
KUU
Electronic Component
K1210L050YR
Electronic Component
1
Electronic Component
2.8mm
Package
1210
Electronic Component
Resettable Fuse
Electronic Component
0.035g
Electronic Component
3.43mm
Electronic Component
1mm
Electronic Component
1
Electronic Component
100ms
Electronic Component
BM0264342986
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
13.2V
Power(Pd)
600mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

K1210L050YR 产品概述

一、产品简介

K1210L050YR 是 KUU 推出的表面贴装自恢复保险元件(PPTC),采用标准 1210 封装,尺寸紧凑(3.43mm × 2.8mm × 1mm),专为手机、电源管理和电脑主板等空间受限但要求可靠过流保护的场景设计。器件支持自动化贴装与回流焊工艺,兼容含铅与无铅工艺,适用于量产 SMT 组装。

二、主要电气与热性能

  • 最高工作耐压(Vmax):13.2 V
  • 最大短时电流(Imax):40 A
  • 保持电流(Ihold):0.5 A(500 mA)——在此电流下器件保持低阻态
  • 跳闸电流(Itrip):1 A——超过此电流后器件进入限流状态
  • 动作时间:约 100 ms(视过流幅度与环境温度而异)
  • 功耗(Pd):600 mW(额定条件下)
  • 初始态阻值(Rmin):≈180 mΩ;跳断后最大阻值(R1max):900 mΩ
  • 工作温度范围:-40 ℃ 至 +85 ℃

三、可靠性与合规

K1210L050YR 已获得 UL(E352136)、C-UL(E352136)与 TUV(R50306076)认证,符合 RoHS、REACH 与 HF(无卤)标准,满足消费电子与工业级安全与环保要求。

四、典型应用与选型建议

适用于手机电源保护、主板电源轨、外设保护及其它需要重复自恢复保护的低压电路。选型要点:

  • 常用工作电流应低于 Ihold,避免长期处于热降额区;若电路存在较大启动浪涌,注意浪涌电流是否短时超过 Itrip 导致频繁动作。
  • 考虑环境温度影响,温度越高器件越容易触发,关键线路需留有安全余量。
  • 若需承受极短时间高幅度脉冲,可评估器件的 Imax 与热冲击能力是否满足要求。

五、封装与工艺建议

标准 1210 封装,适配常规 SMT 贴片工艺。推荐:

  • 在 PCB 上靠近电源输入/电池正极处布局以实现快速保护响应。
  • 遵循制造商推荐的回流温度曲线(器件兼容含铅和无铅回流工艺),并确保合理的焊盘设计与热通量以利于可靠焊接。
  • 避免长期超额电流和频繁触发,以延长器件寿命并保持稳定阻值特性。

总结:K1210L050YR 在小尺寸下提供可靠的自恢复过流保护,认证齐全,适合手机与主板等对体积和自动化组装有较高要求的消费电子应用。

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