WMSIC Electronic Components

KUU KNTC0603/30KJ3950

ModelKNTC0603/30KJ3950
Package0603
BrandKUU
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
KUU KNTC0603/30KJ3950
Type
KUU
Minimum package
4000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
KUU
Electronic Component
KNTC0603/30KJ3950
Electronic Component
1
Electronic Component
0.8mm
Package
0603
Electronic Component
NTCThermistor Resistor
Electronic Component
0.038g
Electronic Component
1.6mm
Electronic Component
30kΩ
Electronic Component
0.8mm
Electronic Component
1
B
±1%
Electronic Component
BM0264356196
Operating Temperature
40℃~+125℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

KNTC0603/30KJ3950 产品概述

一 产品简介

KNTC0603/30KJ3950 是 KUU 品牌的一款小型负温度系数热敏电阻(NTC),采用 0603(1.6 × 0.8 × 0.8 mm)贴片封装,额定功率 100 mW,标称阻值 30 kΩ(在 25℃),电阻公差 ±5%,B 值(25℃/50℃)3950 K(B 值精度 ±1%)。该器件尺寸小、响应快、温度特性稳定,适合对空间和功耗有严格要求的便携与物联网终端温度检测与补偿应用。

二 主要电气与热学参数

  • 标称阻值:30 kΩ(25℃)
  • 电阻精度:±5%
  • B 值(25℃/50℃):3950 K(±1%)
  • B 值(25℃/85℃):3987 K
  • 额定功率:100 mW
  • 最大稳态电流(25℃):180 μA
  • 功耗-温升系数(耗散系数):1 mW/℃(热阻换算)
  • 热时间常数:5 s
  • 工作温度范围:-40 ℃ ~ +125 ℃
  • 封装与尺寸:0603(1.6 × 0.8 × 0.8 mm)
  • 品牌:KUU

三 温度特性与计算说明

NTC 热敏电阻的温度特性通常用 B 值描述,其近似关系为: R(T) = R25 × exp[B × (1/(T+273.15) - 1/(25+273.15))] (T 单位为 ℃,R25 为 25℃ 阻值)。该型号给出的 B25/50 与 B25/85 两个数值可用于不同温区的更精确拟合;B 值精度 ±1% 有利于多器件之间的一致性。

自加热方面:器件的稳态电流上限 180 μA 对应功耗约 0.97 mW(I^2·R),按耗散系数 1 mW/℃ 估算约 0.97 ℃ 温升。实际测量和设计中建议保留裕量,将工作电流控制在较低水平(例如 <50 μA)以把自加热引起的测量误差降到最低。

四 使用建议与注意事项

  • 测量电路:常用电路为上拉电阻/分压并接 ADC。由于器件阻值较大,推荐使用较小的测量电流以降低自热误差(典型 <50 μA)。
  • 电源与阻容选型:在 3.3 V 总线上直接偏置 30 kΩ 时电流约 110 μA;在 5 V 时约 167 μA,接近稳态上限,建议在 5 V 系统中增加分阻或改用更低电压测量接口。
  • 校准与线性化:可用 B 值公式在固件中做温度换算,必要时在出厂或系统启动时做一次校准以补偿阻值公差(±5%)与系统误差。
  • 环境与封装:0603 小型封装适合 SMT 回流工艺,注意按 PCB 设计最佳焊盘与回流曲线操作,避免过度机械应力或重复高温影响可靠性。

五 封装与 PCB 布局建议

  • 推荐将热敏电阻远离大功率发热元件,避免测量误差;若用于感温场合,可将元件放在待测对象附近并使用简洁的热路径。
  • 由于器件体积小,焊盘尺寸应参考 0603 标准,焊膏量适中以保证焊点可靠且热传导一致。
  • 对于精密测温电路,PCB 上尽量减少与地或电源的热桥影响,必要时使用孤岛或热阻设计。

六 应用场景与选型建议

适用于手机配件、穿戴式设备、电池管理系统、物联网传感器、模块温度补偿、家电与小型电源的温度检测与控制场合。选型时权衡阻值、测量电流与响应速度:30 kΩ 的高阻值有利于低耗,但需注意 ADC 输入阻抗与噪声;对要求高精度温度测量的场合,可选用更窄电阻公差或配合一次性校准。

总结:KNTC0603/30KJ3950 在微型化、低功耗温度检测上具备良好性价比,B 值精度高且热时间常数短,适合对空间与能耗敏感的产品。设计时重点控制测量电流与布局热影响,以确保测温精度与稳定性。

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