Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
KUU K1206L100AR
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- KUU K1206L100AR
- Type
- KUU
- Minimum package
- 3500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- KUU
- Electronic Component
- K1206L100AR
- Electronic Component
- 1
- Package
- 1206
- Electronic Component
- Resettable Fuse
- Electronic Component
- 0.031g
- Electronic Component
- 1
- Electronic Component
- 100ms
- Electronic Component
- BM0264342991
- Operating Temperature
- 40℃~+85℃
- Voltage Rating(Vmax)
- 6V
- Power(Pd)
- 600mW
- Current(Imax)
- 100A
- Electronic Component
- Electronic Component
- Electronic Component
- 3500
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
K1206L100AR 产品概述
一、概述
K1206L100AR 是 KUU 提供的一款表面贴装自恢复保险丝（PTC），采用标准 3216mm（1206mils）封装，专为移动设备、主板与接口电源保护设计。器件在过流时快速限制电流并在故障解除后自动恢复，适合自动贴装与回流焊工艺。
二、主要电气参数
- 最大耐压 Vmax：6 V
- 最大通过电流 Imax：100 A（瞬态或短时峰值）
- 保持电流 Ihold：1 A（正常工作不触发）
- 跳闸电流 Itrip：2 A（典型动作阈值）
- 跳断后最大阻值 R1max：280 mΩ
- 初始态最小阻值 Rmin：60 mΩ
- 功耗 Pd：600 mW（稳态最大耗散）
- 动作时间：100 ms
- 工作温度范围：-40 °C 至 +85 °C
三、特性与封装
- 表面贴装封装，符合 1206 尺寸，兼容自动化贴装与回流焊（含铅与无铅工艺）。
- 低初始阻值有利于降低压降与发热；触发后阻值显著上升以限制故障电流。
- 通过 UL(E352136)、C-UL(E352136)、TUV(R50306075) 认证，符合 RoHS、REACH 与 HF（无卤）要求。
四、典型应用
适用于对短路或瞬态过流保护有重复自动复位需求的场景，例如：
- 手机电池与充电/USB 端口保护
- 笔记本与台式机主板的即插即用（热插拔）保护
- 外设供电、防反接与模块化电源保护
五、选型与设计建议
- 电压系统应 ≤6 V，超过该值可能损坏器件或无法保证复位特性。
- 设计保持电流 Ihold 高于正常工作电流且低于触发电流 Itrip，以避免误触发。
- 注意器件 Pd（600 mW）的稳态功耗限制，在高环境温度或密集布板时需考虑散热与热耦合。
- 对于长时大电流场合，应留有足够余量或并联多只器件并配合合理布局。
六、可靠性与焊接注意
- 推荐按厂家回流曲线进行焊接，器件已兼容含铅与无铅回流工艺。
- 避免在贴装后高温长时间重工，防止性能退化。
- 工作温度范围 -40 ℃ 至 +85 ℃，应在该范围内评估动作与恢复特性。
七、典型电路与安装位置
- 建议将 K1206L100AR 放置于电源入口或靠近待保护负载的一端，优先保护来自外部接口的过流。
- 与熔断器、TVS 二极管等配合使用可同时实现过流与过压/浪涌保护。
八、包装与订购信息
- 品牌：KUU；封装：1206（3216mm）。
- 在订购或样品测试时，请注明型号 K1206L100AR，并核对电气参数与认证需求。若需详细封装图与回流曲线，请联系供应商获取完整数据手册。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
