Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
KUU KSI2343CDS-T1-GE3
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- KUU KSI2343CDS-T1-GE3
- Type
- KUU
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- KUU
- Electronic Component
- KSI2343CDS-T1-GE3
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- 1 P
- Type
- P
- Electronic Component
- MOSFET
- Electronic Component
- 0.031g
- Electronic Component
- 1
- Electronic Component
- BM0257316648
- Power Dissipation(Pd)
- 1.4W
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Voltage(Vdss)
- 30V
- Capacitor(Ciss)
- 520pF
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
KSI2343CDS-T1-GE3 — P沟道 MOSFET 产品概述
一、主要特性
KSI2343CDS-T1-GE3 为 KUU 品牌的 P 沟道场效应管，采用 SOT-23 小外形封装，面向空间受限的电源管理与高侧开关场合。器件在中低压环境下表现平衡，主要特性如下：
- 漏源耐压 Vdss：30 V（适用于常见 12V/24V 较低电压系统）
- 连续漏极电流 Id：4.1 A（额定值，实际热条件相关）
- 导通电阻 RDS(on)：110 mΩ @ |Vgs| = 4.5 V（P 型，Vgs = -4.5V）
- 最大耗散功率 Pd：1.4 W（SOT-23 封装受限）
- 典型阈值（幅值）|Vgs(th)| = 2 V @ 250 μA
二、关键电气参数
- 栅极总电荷 Qg：9.2 nC @ 10 V（开关驱动需求中等，需考虑驱动器能力）
- 输入电容 Ciss：520 pF
- 反向传输电容 Crss（Cgd）：65 pF
- 输出电容 Coss：100 pF 封装与电容特性表明器件在开关速度与驱动能量之间有折衷，适合中速开关或作为高侧模拟/数字开关使用。
三、典型应用场景
- 电池供电设备的高侧开关与负载切换
- 便携式设备的电源路径管理、反向电流保护
- 小功率 DC-DC 变换器中的开/关元件（非高频主开关）
- 信号级电源选择、同步整流（配合电路设计）
四、布局与散热建议
SOT-23 封装的 Pd 与散热能力有限，实际可通过 PCB 布局提升：
- 在器件底部和焊盘周围增加铜箔面积，必要时加大顶/底层散热铜厚
- 对流通道进行多热连接或热过孔（via）到内层/底层铜箔
- 减少走线长度与阻抗，尤其是源极与漏极的电流回流路径
- 开关时加入合适的栅阻（10–200 Ω）以抑制振铃，必要时并联 RC 吸收或 TVS
五、使用注意与选型建议
- 虽然标称 Id 为 4.1 A，但在 SOT-23 与典型 PCB 布局下长期大电流受限于热阻，设计时按热功率 Pd（1.4 W）和实际铜箔散热能力进行热仿真与裕量。
- 阈值电压为约 2 V（幅值），意味着需要一定的负向栅压才能充分导通；在逻辑电平驱动时请确认驱动电压余量（注意 P 沟道 Vgs 为负值表示导通）。
- Qg 与 Ciss 指出对驱动器有一定要求：若需高频切换，选择能快速供/吸电荷的驱动方案或限制开关频率。
- 作为高侧开关时可省去升压驱动，但需合理选择门极上拉/下拉电阻以保证开/关可靠。
总结：KSI2343CDS-T1-GE3 在 30 V 等级的高侧开关与电源路径管理中提供了体积小、性能均衡的解决方案。选用时重点关注 PCB 散热与驱动能力，以发挥器件最佳性能。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
