WMSIC Electronic Components

KUU K2N7002-7-F

ModelK2N7002-7-F
PackageSOT-23
BrandKUU
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
KUU K2N7002-7-F
Type
KUU
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
KUU
Electronic Component
K2N7002-7-F
Electronic Component
1
Package
SOT-23
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
0.035g
Electronic Component
1
Electronic Component
BM0264548710
Power Dissipation(Pd)
225mW
Electronic Component
Electronic Component
Electronic Component
3000
Voltage(Vdss)
60V
Capacitor(Ciss)
50pF

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

K2N7002-7-F 产品概述

一、概述

K2N7002-7-F 是一款单颗 N 沟道场效应管(MOSFET),封装为 SOT-23,适用于小信号开关与低功耗负载控制。器件额定漏源电压 Vdss 为 60V,连续漏极电流 Id 为 115mA,导通电阻 RDS(on) 在 Vgs=4.5V 时典型为 3Ω,器件耗散功率 Pd 为 225mW。品牌:KUU。体积小、输入电容低,适合密集 PCB 和便携设备的电平转换与开关应用。

二、主要特性

  • 类型:N 沟道 MOSFET(单只)
  • Vdss:60V
  • 连续漏极电流 Id:115mA
  • RDS(on):3Ω @ Vgs = 4.5V
  • 阈值电压 Vgs(th):2.5V(典型)
  • 耗散功率 Pd:225mW(SOT-23 封装限制)
  • 输入电容 Ciss:50pF;输出电容 Coss:25pF;反向传输电容 Crss:5pF
  • 封装:SOT-23,适合表面贴装生产线

三、电气性能与设计要点

  • 导通与驱动:Vgs(th) ≈ 2.5V 表示在 2.5V 附近开始导通,但为降低 RDS(on) 并保证低损耗,建议门极驱动电压 ≥4.5V。若在 3.3V 系统中使用,应验证 RDS(on) 在 3.3V 下的实际值,开通损耗会增大。
  • 热极限与功耗:器件最大耗散功率 225mW,工作时需满足 Vds × Id ≤ 225mW。举例:在 RDS(on)=3Ω、Id=115mA 时,功耗约为 Id^2·RDS ≈ 39.7mW,远小于 Pd,但在高 Vds 或持续高电流下需注意热管理。
  • 开关速度:Ciss = 50pF、Crss = 5pF,使其在中低频开关(数十 kHz 至几 MHz,视驱动电路而定)表现良好,门极驱动电容负担小,适合快速小信号切换。

四、典型应用

  • 低电流开关与负载接通/断开(继电器驱动前置、指示灯控制等)
  • 电平转换与逻辑信号隔离(TTL/CMOS 侧的低速传输)
  • 便携式设备的电源管理与电池保护电路
  • 小信号放大与模拟开关(注意线性区域下的热耗散)
  • 多路复用、负载选择与反向极性保护电路

五、封装与引脚建议

  • 封装:SOT-23,适合自动贴装与回流焊。典型 SOT-23 引脚排列(请以实际封装数据手册为准):Pin1 = Gate,Pin2 = Drain,Pin3 = Source。
  • PCB 布局:尽量在漏极与源极附近增加铜面以利散热,缩短门极走线并在门极处并联适当阻抗以抑制振铃。若长期接近 Pd 极限,应通过散热铜箔、过孔或隔离底板降温。
  • 焊接与可靠性:按 SOT-23 回流规范进行焊接,避免超出制造商推荐的峰值回流温度和时长,防止器件热损伤。

六、使用建议与注意事项

  • 在高压差、大电流工况下要同时考虑 Vds 与 Pd 的限制,避免器件长期工作在高耗散点。
  • 若用于 3.3V 逻辑系统且对导通损耗敏感,建议评估更低 RDS(on) 的替代型号或提高驱动电压。
  • 在高频开关应用中,关注 Crss 带来的米勒效应,必要时在门极串联阻容以控制开关过渡过程。

K2N7002-7-F 以其 60V 耐压、低输入电容及小尺寸封装适合广泛的低功耗开关与电平控制场景。选型时应结合实际驱动电压、开关频率与热设计,确保长期可靠运行。

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