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KUU RB521S-30
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- KUU RB521S-30
- Type
- KUU
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- KUU
- Electronic Component
- RB521S-30
- Electronic Component
- 1
- Package
- SOD-523
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.023g
- Electronic Component
- 1
- Electronic Component
- BM0264873496
- Current
- 200mA
- Diode
- Electronic Component
- Current(Ir)
- 30uA@10V
- (Vf)
- 500mV@200mA
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Voltage Rating(Vr)
- 30V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
RB521S-30 产品概述
一、产品简介
RB521S-30 是 KUU 品牌的一款独立式肖特基二极管，型号面向小电流、低压降的整流与保护应用。器件采用 SOD-523 小型贴片封装，适合体积受限的消费电子与便携设备。其典型正向压降为 0.5V（在 200mA 条件下），反向耐压 30V，直流整流电流 200mA，10V 时反向漏电流约 30μA。
二、主要特性
- 低正向压降：Vf ≈ 0.5V @ If = 200mA，有利于降低功耗与热量产生。
- 中等耐压：Vr = 30V，适用于多数低压电源与信号线路。
- 小封装：SOD-523，适配高密度贴装与自动化生产。
- 快速响应：肖特基结构固有的无存储电荷特性，适合快速切换与保护场合。
三、典型电气参数
- 型号：RB521S-30（KUU）
- 正向压降：500mV @ 200mA（典型）
- 最大整流电流：200mA（直流）
- 反向耐压：30V
- 反向漏电流：30μA @ 10V
- 封装：SOD-523（独立贴片）
注：上述参数为典型/额定参考值，实际使用请参照厂商完整数据手册并考虑温度漂移与一切寄生影响。
四、主要应用场景
- 低压差整流与电源输出保护（如耳机放大器、微型充电器）
- 便携式设备的反向极性保护与电源路由（电池反接防护）
- 开关电源的辅助整流或二次侧低电流整流
- 信号线保护与钳位（对瞬态电压有一定抑制效果）
五、封装与机械特性
SOD-523 为超小型表贴封装，适合高密度 PCB 布局。器件焊盘面积小，热阻相对较高，长时间大电流工作时需保证 PCB 铜箔散热条件。SOD-523 的尺寸与焊接特性可兼容常见 SMT 回流工艺。
六、使用注意事项
- 功率与散热：在 If = 200mA、Vf ≈ 0.5V 时，器件功耗约 0.1W，长时间工作需评估 PCB 熔铜面积与环境温度，必要时采用铜箔散热或减小占空比。
- 反向漏电：10V 时 Ir ≈ 30μA，在高阻电路或精密采样电路中需注意漏电对测量的影响。
- 极限条件：请勿超出 Vr = 30V 与 If 最大值，以避免击穿或过热损坏。高温会加剧漏电流并降低可靠性，应考虑降额使用。
- 焊接建议：遵循标准回流温度曲线，避免长时间高温，以保护封装与内部接合。
七、典型应用电路简介
- 反向保护：将 RB521S-30 放置于电源输入正极，正向导通时压降低，反接时阻止电流流入，保护后端电路。
- 低压差整流：用于小电流输出的二极管整流，能有效降低额外电压损耗，提升效率。
八、订购与兼容信息
型号：RB521S-30，品牌：KUU，封装：SOD-523。可替换同类参数的肖特基地二极管时，请核对正向压降、最大正向电流、反向耐压与封装尺寸以确保兼容性。
如果需更详细的电气特性曲线、封装尺寸图与回流焊工艺参数，我可为您提供或对比常见替代型号的参数与选型建议。
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