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KUU SMF5.0CA
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- KUU SMF5.0CA
- Type
- KUU
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- KUU
- Electronic Component
- SMF5.0CA
- Electronic Component
- 1
- Package
- SOD-123FL
- Electronic Component
- Electronic Component
- Type
- TVS
- Electronic Component
- ESD and Surge Protection (TVS / ESD)
- Electronic Component
- 0.04g
- Electronic Component
- 1
- Channel Count
- Electronic Component
- Electronic Component
- BM0257646971
- Operating Temperature
- 55℃~+150℃
- Voltage
- 9.2V
- Current(Ir)
- 400uA
- Voltage(VBR)
- 6.4V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SMF5.0CA 产品概述
一、产品简介
SMF5.0CA 是 KUU 品牌的一款单路双向瞬态抑制二极管（TVS），采用 SOD-123FL 封装，适用于对 5V 工作电压等级线路的浪涌与静电放电保护。器件工作温度范围广（-55℃ ~ +150℃），可满足工业级和车规级周边的环境要求，结构紧凑，便于表面贴装与批量生产。
二、主要电气参数与意义
- 反向截止电压 Vrwm：5V —— 适用于额定工作电压约 5V 的电源或信号线。
- 击穿电压 Vbr：6.4V —— 在此电压附近开始导通以吸收过电压。
- 钳位电压 Vclamp：9.2V —— 在峰值脉冲电流作用下的最大钳位电压，决定被保护电路所承受的最高瞬态电压。
- 峰值脉冲电流 Ipp：21.7A —— 单次浪涌时器件能够承受的峰值电流能力。
- 峰值脉冲功率 Ppp：200W —— 在规定脉冲条件下器件可吸收的瞬态功率能力，决定抗雷击/浪涌能力。
- 反向电流 Ir：400μA —— 在 Vrwm 条件下的泄漏电流，对低功耗或高阻抗线路需考虑其影响。 上述参数共同决定了器件在真实系统中对浪涌能量的限制能力与对正常工作电压下的静态影响。
三、典型应用场景
- 5V 电源总线保护（如嵌入式开发板、单片机供电、外设供电）。
- USB2.0/串口/通用信号线的过压与 ESD 防护（双向特性适合信号线双向电平摆幅）。
- 工业控制、楼宇自控和通信设备的前端防护。
- 对环境温度和可靠性要求较高的汽车电子辅助线路（请结合整车认证要求评估）。
四、封装与布局建议
SOD-123FL 封装体积小、热阻适中，适合自动贴装。实际 PCB 设计建议：
- TVS 尽量靠近被保护的连接器或器件放置，以缩短高频瞬态路径。
- 走线尽量短且粗，避免在 TVS 与受保护点间形成长回路。
- 为了多次承受浪涌，考虑在电源线上加入限流电阻或熔断保护，提高系统整体耐受能力。
- 注意焊接工艺与热循环可靠性，避免过热损伤封装材料。
- 对于对泄漏电流敏感的系统，应评估 400μA 在工作电压下的影响，必要时选择更低漏电型号或在软硬件上做补偿。
五、选型与使用注意
- 双向型适用于信号线有正负摆幅或需对称保护的场合；若仅需单向保护（例如典型 DC 电源正极），可考虑单向型 TVS。
- 确认系统内可能出现的浪涌幅度和持续时间，与 TVS 的能量吸收能力匹配；对高能量或重复冲击场合，应采用更高 Ppp 或配合浪涌抑制器件。
- 关注工作环境温度对器件性能与寿命的影响，必要时进行热仿真与老化试验。
总结：SMF5.0CA 以其 5V 适配性、双向保护特性和 SOD-123FL 贴片封装，适合中低压数字与电源线路的瞬变浪涌与 ESD 防护。在具体应用中应结合泄漏、钳位电压与系统容错能力做综合评估与 PCB 布局优化。
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