Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
KUU KESD0524P
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- KUU KESD0524P
- Type
- KUU
- Minimum package
- 3000 编带
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- KUU
- Electronic Component
- KESD0524P
- Electronic Component
- 1
- Package
- DFN2510-10
- Electronic Component
- Electronic Component
- Type
- ESD
- Electronic Component
- ESD and Surge Protection (TVS / ESD)
- Electronic Component
- 0.028g
- Electronic Component
- 1
- Channel Count
- Electronic Component
- Cj- Capacitor
- 0.2pF
- Electronic Component
- BM0258756612
- Operating Temperature
- 55℃~+125℃
- Voltage
- 15V
- Electronic Component
- IEC 61000-4-4；IEC 61000-4-2
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
KESD0524P 产品概述
一、产品简介
KESD0524P 是一款单向四路瞬态电压抑制（ESD）保护器件，采用 KUU 品牌并封装于 DFN2510-10。器件专为保护敏感数据线和接口免受静电放电与脉冲干扰设计，工作环境温度范围广（-55℃ 至 +125℃，以结温 Tj 计），适合消费电子与工业级应用。
二、主要特性
- 极性：单向（对地钳位，适用于电源正向抑制与信号线保护）
- 工作反向截止电压 Vrwm：5 V
- 钳位电压 Vclamp（典型）：15 V
- 击穿电压 Vbr：9 V
- 峰值脉冲电流 Ipp：4 A（单次 IEC 型脉冲条件）
- 峰值脉冲功率 Ppp：60 W
- 反向漏电流 Ir：≤1 μA
- 结电容 Cj：0.2 pF（低电容适合高速信号线）
- 通道数：四路（可独立保护四根线）
- 工作温度：-55℃ ~ +125℃（Tj）
- 防护等级：符合 IEC 61000-4-4（EFT）与 IEC 61000-4-2（ESD）
三、封装与机械信息
- 封装类型：DFN2510-10（紧凑表贴，小尺寸适合集成在连接器附近）
- 建议在 PCB 上提供良好接地回流路径，暴露焊盘（exposed pad）应与地平面焊接以增强散热与抑制回射。
四、典型应用
- USB、HDMI、MIPI、LVDS 等高速数据接口的输入/输出保护
- 智能手机、平板、相机等消费电子设备的外部接口防护
- 工业控制与通信接口的浪涌与静电防护
- 传感器线路与微控制器 I/O 口保护
五、设计与使用建议
- 器件应尽量靠近受保护的连接器或接口布置，走线最短以降低感应噪声与提高钳位效率。
- 地线应采用低阻抗回流，建议在器件底部连接地平面并使用过孔与地平面连接。
- 对于对钳位电压敏感的系统，可配合串联小电阻或共模滤波器以分担能量并降低瞬态冲击。
- 在高速信号应用中，0.2 pF 的低结电容有利于维持信号完整性，但需验证对特定协议的可兼容性。
六、可靠性与合规
KESD0524P 满足 IEC 61000-4-2（静电放电）与 IEC 61000-4-4（快速瞬变脉冲群）要求，低漏电与宽工作温度确保在苛刻环境下的稳定性。标准化测试应在指定脉冲波形、能量与重复条件下进行，确保系统级符合性。
如需进一步的引脚分配、典型等效电路图或推荐 PCB 封装图样，可根据实际接口数量与布板空间提供对应建议。
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