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KUU SS16
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- KUU SS16
- Type
- KUU
- Minimum package
- 2000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- KUU
- Electronic Component
- SS16
- Electronic Component
- 1
- Package
- SMA(DO-214AC)
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.092g
- Electronic Component
- 1
- Electronic Component
- BM0257646974
- Current
- 1A
- Diode
- 1
- Current(Ir)
- 300uA@60V
- (Vf)
- 700mV@1A
- Electronic Component
- 55℃~+125℃
- Electronic Component
- Electronic Component
- Electronic Component
- 2000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SS16（KUU）肖特基二极管 产品概述
一、主要参数
- 型号：SS16（品牌：KUU）
- 封装：SMA (DO-214AC)，独立式
- 正向压降：Vf ≈ 700 mV @ 1 A
- 直流反向耐压：Vr = 60 V
- 整流电流：IF (平均) = 1 A
- 反向漏电流：Ir ≈ 300 µA @ 60 V（典型）；规格资料中亦列出可达 500 µA @ 60 V，具体数值与测试条件及温度有关
- 非重复峰值浪涌电流：Ifsm = 30 A
- 工作结温：-55 ℃ ~ +125 ℃
二、产品特性与优势
- 低正向压降：在 1 A 工作电流下 Vf 约 0.7 V，可在中低功率整流场合减少功耗和发热，相比传统硅整流器效率更高。
- 快速响应：肖特基结构使得反向恢复时间极短，适合高频整流与开关电源应用，可降低开关损耗和电磁干扰。
- 良好浪涌能力：30 A 峰值浪涌电流满足开机或突发负载情况下的脉冲能力。
- 紧凑封装：SMA/DO-214AC 封装便于自动贴装与波峰/回流焊，适合空间受限的电路板布局。
三、典型应用场景
- 开关电源（输出整流、同步整流替代）
- 电池管理与反接保护电路
- 适配器、充电器、USB 电源线保护
- DC-DC 转换器、高频整流场合
- 汽车电子（非汽车级需确认温度与振动规格）与工业控制低功率整流
四、设计与使用建议
- 散热考虑：尽管封装小巧，实际应用中应通过加大PCB铜箔面积或在焊盘处连接散热铜箔以降低结温，延长寿命并降低漏电流。
- 漏电随温升增大：在高温环境下 Ir 会显著上升，若工作于高温或高反向电压场合应留有裕量或采用低漏型器件。
- 焊接工艺：遵循 SMA 封装常规回流曲线，避免超过器件允许的最大结温；必要时参考厂家推荐的焊接温度/时间规范。
- PCB 布局：焊盘短且宽以降低热阻，正负极走线尽量粗短，靠近负载放置以降低寄生电感和压降。
五、注意事项与替代方案
- 若对漏电流敏感或在高温下工作，建议选用标称 Ir 更小或专用低漏肖特基型号。
- 若需更低正向压降以降低功耗，可考虑更先进的低 Vf 肖特基或使用同步整流方案。
- 在关键或汽车级应用中，请参考完整数据手册并确认器件的环境与可靠性认证。
总结：KUU SS16 为一款性价比较高的 1 A / 60 V 肖特基二极管，适合多数中低功率整流与保护应用。在实际设计中注意热管理与漏电随温度的变化，即可获得稳定可靠的性能表现。
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