WMSIC Electronic Components

KUU 1N5819WS SL

Model1N5819WS SL
PackageSOD-323
BrandKUU
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
KUU 1N5819WS SL
Type
KUU
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
KUU
Electronic Component
1N5819WS SL
Electronic Component
1
Package
SOD-323
Electronic Component
Schottky Diode
Electronic Component
0.029g
Electronic Component
1
Electronic Component
BM0264356205
Current
1A
Diode
Electronic Component
Current(Ir)
75uA@6V
(Vf)
900mV@3A
Electronic Component
Electronic Component
Electronic Component
3000
Voltage Rating(Vr)
40V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

1N5819WS SL 产品概述

一、产品简介

1N5819WS SL 是 KUU 品牌的一款独立式肖特基(Schottky)整流二极管,采用 SOD-323 表面贴装封装。该器件针对高效率、低压降的整流和保护用途设计,兼具小体积和较好的冲击耐受能力,适合移动设备、电源管理和高频开关场合。

二、主要电气特性

  • 正向压降(Vf):约 0.9V(测试条件 3A,脉冲)。
  • 额定整流电流(Io):1A(连续整流)。
  • 直流反向耐压(Vr):40V。
  • 反向漏电流(Ir):75µA(在 Vr=6V 时)。
  • 非重复峰值浪涌电流(Ifsm):25A(单次浪涌脉冲能力)。

说明:数据中 Vf 在 3A 条件下给出,通常为脉冲测试项;器件长期连续工作时应以 1A 连续整流额定值为设计基准,以保证温升与可靠性。

三、封装与机械特性

  • 封装类型:SOD-323(小型贴片封装)。
  • 优势:体积小、焊盘占用面积低,适合空间受限的 PCB 布局。
  • 建议焊盘和回流工艺按厂方推荐的 PCB land pattern 和温度曲线执行,以避免焊接缺陷或应力导致的机械损伤。

四、关键优势

  • 低正向压降:相较于普通硅整流二极管,肖特基二极管的 Vf 更低,可降低整流损耗与发热,提高整体系统效率。
  • 快速恢复特性:肖特基结构无存储电荷,开关损耗低,适合高频开关电源或 PWM 驱动。
  • 良好的浪涌承受能力:25A 的非重复峰值浪涌能力可满足启动瞬间或短时过流冲击场景。
  • 小封装、高密度应用友好:SOD-323 有利于手机、可穿戴、便携充电器等小型化产品设计。

五、典型应用场景

  • 开关电源(D1 整流、回收二极管)
  • DC-DC 转换器输出整流
  • 反向保护与防反接电路
  • 电池充放电路径与电源路径管理
  • 高频脉冲环境中的快速整流场合

六、使用与装配建议

  • 在高电流应用(接近或超过 1A)时,应关注封装温升与散热路径,必要时使用散热铜箔或改善散热布局。
  • 对于反向电压接近 40V 的工作点,应预留安全裕量,避免长时间在 Vr=40V 下工作以减少漏电增长与可靠性风险。
  • 焊接建议采用标准回流焊工艺,最大峰值温度与时间参照制造商推荐规范;避免手工焊接造成热应力损伤。

七、可靠性与注意事项

  • 反向漏电随温度显著增加,工作环境温度高时需留意 Ir 上升对系统待机功耗的影响。
  • 长期承受重复高浪涌会降低器件寿命,应结合熔断或限流保护电路使用。
  • 对 ESD 和过压环节做适当保护,防止瞬态损伤。

总体而言,1N5819WS SL 在小型化、高效率和快速响应方面具有显著优势,适合对空间和能效有较高要求的整流与保护应用。根据具体电流与温度工况,合理设计 PCB 散热与保护措施,可获得稳定可靠的使用表现。

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