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KUU SS13
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- KUU SS13
- Type
- KUU
- Minimum package
- 2000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- KUU
- Electronic Component
- SS13
- Electronic Component
- 1
- Package
- SMA(DO-214AC)
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.01g
- Electronic Component
- 1
- Electronic Component
- BM0264548715
- Current
- 1A
- Diode
- Electronic Component
- Current(Ir)
- 500uA@30V
- (Vf)
- 550mV@1A
- Electronic Component
- 50℃~+125℃
- Electronic Component
- Electronic Component
- Electronic Component
- 2000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SS13（KUU）肖特基二极管 产品概述
一、产品简介
SS13 为 KUU 品牌的独立式肖特基整流二极管，封装为 SMA (DO-214AC)。主要电气参数包括：正向压降 Vf = 0.55V @ 1A，额定整流电流 1A，直流反向耐压 Vr = 30V，反向漏电流 Ir = 500μA @ 30V，非重复峰值浪涌电流 Ifsm = 30A，工作结温范围 -50℃ 至 +125℃。该器件定位为低压、低损耗、高速整流与保护用途的通用型肖特基二极管。
二、主要电气特性
- 正向压降低：0.55V @ 1A，有利于降低整流损耗与发热，适合对效率敏感的电源应用。
- 反向耐压：30V，适用于 5V、12V 等低压系统的反向保护与整流。
- 反向漏电流：500μA @ 30V（典型或最大值需参照具体器件数据手册），肖特基结构在高温下漏电会显著增加，使用时需考虑温升影响。
- 峰值浪涌承受：30A（非重复），支持开机浪涌或短时大电流脉冲，但不宜长期超过额定整流电流。
三、封装与热管理
SMA (DO-214AC) 为表面贴装封装，体积小、焊接方便。尽管单只器件功耗不大，但在持续大电流或高频整流情形下会产生较多热量，推荐：
- PCB 设计时增加焊盘铜箔面积与散热通孔以降低结温；
- 链路走线尽量短宽，减小电阻损耗并利于热传导；
- 若工作电流接近或超过 1A，应评估结温并留足裕量。
四、典型应用场景
- 开关电源次级整流与同步整流替代方案；
- 反向电池保护、输入极性保护与电流 OR-ing；
- 二极管耦合的低压降电源轨、快恢复整流与功率路径控制；
- 汽车电子、通信设备、消费类电子的局部整流与防反接保护（在额定电压范围内）。
五、使用注意事项
- 避免长期在高温条件下工作，因为肖特基二极管的反向漏电随温度上升显著增加；
- 不要超过 30V 反向电压或 1A 连续整流电流，短时浪涌可承受 Ifsm = 30A；
- 焊接工艺请参考封装温度极限与过程曲线，避免热循环造成焊点或器件应力损伤；
- 若需要更高电压或更低漏电，可考虑同系列的其他型号（如 SS14、SS16 等）或使用肖特基替代型号。
六、规格总结
品牌：KUU
型号：SS13（肖特基）
封装：SMA (DO-214AC)
关键参数：Vf = 0.55V @ 1A；Vr = 30V；Ir = 500μA @ 30V；Ifsm = 30A；整流电流 = 1A；工作结温 -50℃~+125℃。
该器件适合对体积、开关速度和低压降有要求的应用场景，采用合理的热设计与工作条件可获得良好的可靠性与效率表现。
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