Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
KUU SS310
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- KUU SS310
- Type
- KUU
- Minimum package
- 2000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- KUU
- Electronic Component
- SS310
- Electronic Component
- 1
- Package
- SMA
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.21g
- Electronic Component
- 1
- Electronic Component
- BM0264873494
- Current
- 3A
- Diode
- Electronic Component
- Current(Ir)
- 500uA@100V
- (Vf)
- 850mV@3A
- Electronic Component
- 50℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 2000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SS310 产品概述
一、产品简介
SS310 为 KUU 品牌独立式肖特基整流二极管，封装为常用的 SMA 表面贴装型。该器件设计用于中等功率整流与保护场合，兼顾开关损耗与冲击耐受能力，是电源、驱动与保护电路中常见的选择。
二、主要规格参数
- 二极管类型：肖特基（独立式）
- 正向压降 (Vf)：0.85 V @ 3 A
- 直流反向耐压 (Vr)：100 V
- 额定整流电流：3 A（连续）
- 反向电流 (Ir)：500 µA @ 100 V
- 非重复峰值浪涌电流 (Ifsm)：100 A（单次脉冲）
- 工作结温范围：-50 ℃ ~ +150 ℃
- 封装：SMA
三、性能与特性
- 低正向压降：在大电流 3 A 条件下典型正向压降为 0.85 V，导通损耗 P ≈ 2.55 W，适合要求较低导通损耗的整流或回灌路径。
- 中等反向耐压：100 V 的耐压等级适用于多数开关电源、LED 驱动与一般工业电源应用。
- 漏电流水平：在 100 V 下反向漏电 500 µA，为中等值；对待机功耗敏感的场合需注意温度对漏电的放大效应。
- 冲击与可靠性：100 A 的单次浪涌电流能力使其能承受启动或短时冲击电流，但长期或重复浪涌需通过热和电应力评估。
四、典型应用场景
- 开关电源输出整流与续流二极管
- DC-DC 转换器与工控电源整流
- 逆向保护、极性防护和反接保护电路
- LED 驱动与中低功率电源模块
- 需要短时耐冲击能力的负载回收场合
五、封装与热管理建议
SMA 为小型表面贴装封装，安装密度高但散热能力受限。建议：
- 在 PCB 设计中增大焊盘面积与铜箔散热层，必要时增加过孔连至内层铜或背铜以降低结温。
- 按实际工作电流计算功耗并进行结到环境热阻评估，保证在最大工况下结温不超标（工作结温上限 +150 ℃）。
- 对于频繁或高幅度浪涌应用，应评估器件的热阻与寿命影响，考虑并联或采用更大封装器件。
六、选型建议与注意事项
- 若关注最低导通损耗且工作电流持续较大，可对比低 Vf 的肖特基替代品或更大封装型号以降低结温。
- 对待机功耗敏感的设计，应关注反向漏电随温度上升而增加的特性，在高温环境下应做余量评估。
- 在高压或高电流冲击场合，注意 Ifsm 的非重复属性，避免重复超规格浪涌。
- 检查封装与 PCB 工艺匹配（焊盘、回流曲线），以保证可靠焊接与热性能。
总结：SS310 在 SMA 封装下提供了 100 V 耐压、3 A 连续整流和 100 A 单次浪涌能力，适合中等功率整流与保护用途。选型时重点关注正向压降导致的功耗、反向漏电随温度的变化以及封装的散热能力，以确保在目标应用中的长期可靠运行。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
