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KUU SK34
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- KUU SK34
- Type
- KUU
- Minimum package
- 2000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- KUU
- Electronic Component
- SK34
- Electronic Component
- 1
- Package
- SMA(DO-214AC)
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.115g
- Electronic Component
- 1
- Electronic Component
- BM0231142801
- Current
- 3A
- Diode
- Electronic Component
- Current(Ir)
- 500uA@40V
- (Vf)
- 550mV@3A
- Electronic Component
- 65℃~+125℃
- Electronic Component
- Electronic Component
- Electronic Component
- 2000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SK34 产品概述
一、概述与主要参数
SK34 为 KUU 品牌的一款独立式肖特基整流二极管，封装为 SMA (DO-214AC)。该器件面向中小功率整流与保护场合，关键参数如下：
- 正向压降 Vf = 0.55 V @ 3 A
- 直流整流电流 IF(AV) = 3 A
- 直流反向耐压 VR = 40 V
- 反向电流 IR = 500 μA @ 40 V（室温标称，随温度上升明显增加）
- 非重复峰值浪涌电流 Ifsm = 100 A（单次冲击，典型按半波冲击测试）
- 工作结温范围 TJ = -65 ℃ ~ +125 ℃
- 配置：独立二极管
该器件利用肖特基结构实现低正向压降与快速恢复特性，适合提升整流效率与降低开关损耗的场合。
二、主要特性与优势
- 低正向压降：0.55 V @ 3 A 可显著降低导通损耗，提升效率，对功率敏感的开关电源、DC-DC 转换器尤为有利。
- 快速响应：肖特基特性使其在高频整流、续流与反向保护中表现稳定，减少开关过渡能量损失。
- 良好浪涌能力：Ifsm = 100 A，可承受短时启动或故障条件下的浪涌电流。
- 宽工作温度范围：-65 ℃ ~ +125 ℃，适应较苛刻的工业环境。
三、典型应用场景
- 开关电源和整流输出二极管（降压/升压电源）
- 电机驱动与功率模块中的续流（二极管并联或单独使用）
- 反向电源保护与电源 OR-ing
- 高频整流与同步整流替代方案（在合适电流与电压范围内）
- 汽车电子、通信设备以及工业控制电路（需注意环境温度下的反向泄漏）
四、热设计与选型注意
- 热功耗估算：在 3 A 负载下，Pd ≈ Vf × I ≈ 0.55 V × 3 A = 1.65 W，持续功耗需通过 PCB 铜箔散热或外加散热措施降温以确保结温不超限。
- 漏电流随温度上升显著增加，长期高温工作时需按实际环境对额定电流进行降额设计。
- 浪涌指标为非重复峰值，若系统存在频繁冲击应选用更高 Ifsm 或并联/保护电路。
- PCB 布局建议：减短环路长度，增大焊盘与散热铜箔面积，必要时使用多层散热通孔提升热传导。
五、封装与可靠性、焊接
- 封装：SMA (DO-214AC)，适合自动贴装与回流焊工艺。
- 焊接：遵循 IPC/JEDEC 无铅回流温度曲线，避免超过器件最大结温，回流峰值温度与时间按封装规范控制。
- 可靠性：正常使用条件下具有良好的机械与热稳定性，建议在高湿、高温环境下做额外可靠性验证。
六、选型建议与替代比较
选择时应重点对比 Vf、Vr、Ir、Ifsm 与封装形式。若需更低正向压降或更高耐压/浪涌能力，可在相近封装中查找额定更高的肖特基器件。更换替代型号时请严格对照完整数据手册，关注浪涌测试条件与热阻参数。
备注：本概述基于器件典型参数与常见应用经验，具体电路设计请结合目标应用的实际工况与厂商完整数据表进行验证。
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