Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
kinghelm KH-IPEX-K501-29
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- kinghelm KH-IPEX-K501-29
- Type
- KINGHELM
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- KINGHELM
- Electronic Component
- KH-IPEX-K501-29
- Electronic Component
- 1
- Package
- SMD
- Electronic Component
- RFCoaxial Connector
- Electronic Component
- 0.093g
- Electronic Component
- 50Ω
- Frequency
- 3GHz
- Electronic Component
- 1
- Electronic Component
- BM0123299382
- RF
- IPEX
- Operating Temperature
- 40℃~+90℃
- Interface
- 2mm
- Interface Type
- Electronic Component
- Electronic Component
- 1
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：KH-IPEX-K501-29 RF射频同轴连接器
概述
KH-IPEX-K501-29是金航标（Kinghelm）推出的一款高性能RF射频同轴连接器，专为高频信号传输而设计。该连接器具备内针设计，使其能够在各种应用场景中提供可靠的信号传输，适应广泛的电子产品需求。其2mm SMD封装使其在扩大设计灵活性的同时，也用于降低整体电路的体积，适合现代紧凑型电子设备。
主要特点
内针设计： KH-IPEX-K501-29采用内针设计，具有良好的信号耦合性能，能有效降低传输损耗，保障信号的完整性。这种设计非常适合需要高频信号传输的应用，包括无线通信、移动设备和其他电子产品。
SMD封装： 这款连接器的表面贴装（SMD）封装形式使得元件在电路板上的安装迅速而便捷，更加适应现代自动化生产线。同时，SMD封装也为设计师提供了更多的排列灵活性，有效节省了电路板空间。
兼容性： KH-IPEX-K501-29连接器能够与多种标准和设备兼容，适用于各类射频应用，从消费类电子产品到工业设备再到通信基础设施均可广泛应用。
高频性能： 连接器特别设计用于高频信号的传递，确保在频率范围内维持优异的插入损耗和反射损耗性能，满足在高频环境下的严格要求，适合频率范围可达几GHz。
耐用性和可靠性： 采用优质材料和精密制造工艺，KH-IPEX-K501-29连接器具备出色的耐用性和长期使用的可靠性，能够在各种恶劣环境条件下稳定工作，保持良好的电气性能。
应用场景
KH-IPEX-K501-29连接器被广泛应用于多种领域，主要包括：
无线通信：在2G/3G/4G/5G基站、天线、路由器等无线设备中，提供高效的RF信号传输，实现高质量的通信链接。
消费电子：在智能手机、平板电脑、智能家居设备等产品中，用于连接无线模块、天线等，提高信号强度和传输效率。
工业设备：适用于自动化设备、传感器模块及监控系统中，以确保信号稳定并实时传输数据。
医疗设备：在医疗监测设备和无创式通信设备中，保证信号的准确传输和设备间的可靠连接。
结论
KH-IPEX-K501-29 RF射频同轴连接器是一款功能强大、设计精巧的元件，适合各种高频应用场景。凭借其内针设计、SMD封装及卓越的性能，金航标为电子产品开发人员提供了一个可靠的解决方案，使其能够在现代高频通信领域中实现卓越的信号传输目标。无论是消费电子、无线通信还是工业自动化，KH-IPEX-K501-29均是实现高信号完整性的理想选择。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
