WMSIC Electronic Components

KOA RK73H1ETTP3093F

ModelRK73H1ETTP3093F
Package0402
BrandKOA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
KOA RK73H1ETTP3093F
Type
KOA
Unit
Electronic Component
Minimum package
10000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
KOA
Electronic Component
RK73H1ETTP3093F
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.011g
Electronic Component
309kΩ
Electronic Component
1
Electronic Component
BM0265802654
Operating Temperature
55℃~+155℃
Operating Voltage
75V
Electronic Component
±100ppm/℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RK73H1ETTP3093F 厚膜贴片电阻产品概述

一、产品核心定位与市场价值

RK73H1ETTP3093F是日本KOA公司推出的超小型厚膜贴片电阻,针对高密度PCB设计、高精度电路需求,平衡了小体积与宽温域性能,可覆盖消费电子、工业控制、IoT等多领域应用。其核心优势在于以0402封装实现±1%精度、155℃高温适配,满足小型化设备对“小尺寸+高可靠性”的双重需求。

二、关键性能参数与技术优势

(1)阻值精度与稳定性

阻值309kΩ±1%,精准度满足大多数模拟电路(如信号放大、分压采样)的设计要求,避免因阻值偏差导致的信号失真或电源效率损耗;±100ppm/℃温度系数保障温度变化100℃时,阻值漂移仅0.01%,极端温域下电路性能稳定。

(2)功率与电压容量

100mW额定功率适配小信号电路(如传感器信号调理、MCU外围电路);75V工作电压可覆盖12V/24V工业系统、汽车低压电路的分压/限流场景,无需额外并联电阻。

(3)宽温域工作能力

工作温度范围-55℃+155℃,覆盖**工业级(-4085℃)及部分汽车级(125℃)**场景,可应对户外IoT传感器(低温环境)、工业烤箱控制模块(高温场景)等极端工况。

三、封装设计与物理特性

(1)超小型封装规格

采用英制0402封装(对应公制1005),尺寸为1.0mm(长)×0.5mm(宽)×0.4mm(厚),属于贴片电阻的最小规格之一,适配高密度PCB布线(如智能手机主板、可穿戴设备)。

(2)焊接兼容性

支持回流焊、激光焊等主流贴片工艺,焊接可靠性高,适配自动化生产流水线;无铅封装符合RoHS/REACH环保标准,满足全球市场合规要求。

四、可靠性与环境适应性

(1)厚膜工艺优势

采用丝网印刷+高温烧结工艺,电阻膜层附着力强,抗冲击振动性能优于薄膜电阻,适合移动设备(如智能手机跌落测试)、工业振动环境(如电机控制模块)。

(2)长期稳定性

KOA全流程自动化生产+严格参数测试,每批次产品阻值漂移率≤0.1%/1000小时,满足批量应用的一致性需求,降低售后维护成本。

五、典型应用场景

  1. 消费电子:智能手机/平板的PMU电源管理、音频信号滤波电路(小体积适配主板紧凑设计);
  2. 工业控制:PLC模块的信号放大、传感器分压采样(宽温域适配车间高温/低温环境);
  3. IoT设备:智能手表/手环的心率传感器调理、户外环境监测节点(超小体积降低设备尺寸);
  4. 通信设备:基站辅助控制电路、路由器信号衰减器(高精度保障信号稳定);
  5. 汽车电子:仪表盘背光控制、车身温度传感器信号调理(155℃温域适配发动机舱附近场景)。

六、品牌与品质保障

KOA作为日本老牌被动元件厂商(成立于1940年),专注电阻研发70余年,产品广泛应用于丰田、松下等企业的核心设备;RK73H1ETTP3093F通过IATF16949汽车级认证(部分批次),提供样品申请、技术文档支持及稳定批量供货,适配客户从研发到量产的全流程需求。

该产品以“小体积+高精度+宽温域”的综合优势,成为小型化电子设备的高性价比电阻选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.