Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
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RK73H1ETTP3093F是日本KOA公司推出的超小型厚膜贴片电阻,针对高密度PCB设计、高精度电路需求,平衡了小体积与宽温域性能,可覆盖消费电子、工业控制、IoT等多领域应用。其核心优势在于以0402封装实现±1%精度、155℃高温适配,满足小型化设备对“小尺寸+高可靠性”的双重需求。
阻值309kΩ±1%,精准度满足大多数模拟电路(如信号放大、分压采样)的设计要求,避免因阻值偏差导致的信号失真或电源效率损耗;±100ppm/℃温度系数保障温度变化100℃时,阻值漂移仅0.01%,极端温域下电路性能稳定。
100mW额定功率适配小信号电路(如传感器信号调理、MCU外围电路);75V工作电压可覆盖12V/24V工业系统、汽车低压电路的分压/限流场景,无需额外并联电阻。
工作温度范围-55℃+155℃,覆盖**工业级(-4085℃)及部分汽车级(125℃)**场景,可应对户外IoT传感器(低温环境)、工业烤箱控制模块(高温场景)等极端工况。
采用英制0402封装(对应公制1005),尺寸为1.0mm(长)×0.5mm(宽)×0.4mm(厚),属于贴片电阻的最小规格之一,适配高密度PCB布线(如智能手机主板、可穿戴设备)。
支持回流焊、激光焊等主流贴片工艺,焊接可靠性高,适配自动化生产流水线;无铅封装符合RoHS/REACH环保标准,满足全球市场合规要求。
采用丝网印刷+高温烧结工艺,电阻膜层附着力强,抗冲击振动性能优于薄膜电阻,适合移动设备(如智能手机跌落测试)、工业振动环境(如电机控制模块)。
KOA全流程自动化生产+严格参数测试,每批次产品阻值漂移率≤0.1%/1000小时,满足批量应用的一致性需求,降低售后维护成本。
KOA作为日本老牌被动元件厂商(成立于1940年),专注电阻研发70余年,产品广泛应用于丰田、松下等企业的核心设备;RK73H1ETTP3093F通过IATF16949汽车级认证(部分批次),提供样品申请、技术文档支持及稳定批量供货,适配客户从研发到量产的全流程需求。
该产品以“小体积+高精度+宽温域”的综合优势,成为小型化电子设备的高性价比电阻选择。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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