Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
KOA RK73H1ETTP1002F
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- KOA RK73H1ETTP1002F
- Type
- KOA
- Unit
- Electronic Component
- Minimum package
- 10000 圆盘
Technical parameters
- Power
- 100mW
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- KOA
- Electronic Component
- RK73H1ETTP1002F
- Electronic Component
- 1
- Package
- 402
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.011g
- Electronic Component
- 10kΩ
- Electronic Component
- 1
- Electronic Component
- BM0259575425
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 75V
- Electronic Component
- ±100ppm/℃
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
RK73H1ETTP1002F 产品概述
一、产品概述
RK73H1ETTP1002F 是由 KOA Speer Electronics, Inc. 生产的一款高性能厚膜贴片电阻，属于 RK73H 系列。该产品专为高可靠性应用而设计，符合汽车级 AEC-Q200 认证，展现出优良的防潮特性以及广泛的工作温度范围。其小巧的封装、稳定的电气性能，特别适合在空间受限且要求高性能的电子设备中使用，如汽车电子、消费电子和工业自动化等领域。
二、技术参数
- 制造商：KOA Speer Electronics, Inc.
- 系列：RK73H
- 零件状态：有源
- 包装：卷带（TR）
- 容差：±1%
- 额定功率：0.1W (1/10W)
- 成分：厚膜
- 特性：符合汽车级 AEC-Q200，具备防潮能力
- 温度系数：±100ppm/°C
- 工作温度范围：-55°C ~ 155°C
- 封装/外壳：0402 (1005 公制)
- 等级：AEC-Q200
- 供应商器件封装：402
- 尺寸：0.039" 长 x 0.020" 宽 (1.00mm x 0.50mm)
- 最大高度：0.016" (0.40mm)
- 端子数：2
- 电阻值：10 kΩ
三、性能特征
紧凑尺寸： RK73H1ETTP1002F 采用 0402 封装，在可用空间非常有限的情况下为设计师提供更多选择。这种超小型设计能够有效地减少电路板的空间占用，同时保证电阻值和功率承受能力。
优良的电气性能： 该电阻的容差为 ±1%，意味着其电阻值的稳定性和一致性出色，适合需要高精度的应用。此外，在宽温度范围内（-55°C ~ 155°C）保持性能稳定，使其成为极端环境下的理想选择。
符合汽车级标准： AEC-Q200 认证确保了该电阻在汽车电子应用中具有更高的可靠性和耐用性，能够承受汽车环境中的各种应力。
防潮特性： 适用于对湿度敏感的系统，确保在潮湿环境下不会出现性能下降的问题。这种特性在汽车和消费电子产品中尤为重要，可以有效提高整个系统的可靠性。
温度系数稳定： ±100ppm/°C 的温度系数使该电阻在不同环境温度下电阻值变化微小，确保设计在重载和恶劣工作条件下依然可靠。
四、应用领域
RK73H1ETTP1002F 适用于多个领域，包括但不限于：
- 汽车电子：如车载导航系统、引擎控制单元（ECU）、传感器等。
- 消费电子：智能手机、平板电脑及其他便携式设备的电路设计。
- 工业自动化: 可靠的电阻可用于各种工业控制系统。
- 医疗设备：可在对尺寸和性能有严格要求的医疗电子设备中使用。
五、总结
总体而言，RK73H1ETTP1002F 是一款高可靠性的小型厚膜贴片电阻，具备优异的电气性能、较强的环境适应能力和广泛的应用前景。其紧凑的设计与高精度特性使其在现代电子设计中逐渐成为不可或缺的元件。无论在何种高要求的场景中，这款电阻都能满足严格的性能需求，提供高效、稳定的解决方案。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
