Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
RK73H1ETTP4991F是日本KOA公司推出的厚膜贴片电阻,采用行业通用的0402封装(公制尺寸1.0mm×0.5mm),属于小体积高密度贴片元件。厚膜电阻通过丝网印刷将电阻浆料沉积在陶瓷基底上,经高温烧结形成电阻体,兼具成本优势与性能稳定性,是电子电路中最常用的电阻类型之一。
该产品型号命名遵循KOA标准规则:
标称阻值为4.99kΩ,精度达±1%,满足多数精密电路对电阻值的控制要求——无需额外筛选即可用于信号调理、分压、限流等场景,避免因阻值偏差导致的电路性能波动。
温度系数为**±100ppm/℃**,表示温度每变化1℃,阻值变化量为标称值的百万分之一百。例如,当温度从25℃升至125℃(温差100℃),阻值变化约±0.499Ω,宽温环境下仍能保持性能稳定。
该产品的工作温度范围为-55℃至+155℃,覆盖了极端低温(如户外低温环境)到高温(如功率器件附近热环境)的广泛场景,符合工业级电子元件的温度要求。
厚膜电阻的陶瓷基底具有良好热稳定性,配合KOA浆料配方优化,使得产品在宽温范围内阻值漂移得到有效控制,同时具备抗潮湿、抗机械应力能力,适合复杂环境下长期稳定工作。
由于0402封装的小体积、1/10W功率适配性,以及±1%精度的实用价值,RK73H1ETTP4991F广泛应用于:
该产品凭借稳定的性能、适配的参数与可靠的品牌背书,成为电子电路设计中高性价比的厚膜电阻选型之一。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products