WMSIC Electronic Components

KOA RK73H1ETTP4991F

ModelRK73H1ETTP4991F
Package0402
BrandKOA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
KOA RK73H1ETTP4991F
Type
KOA
Unit
Electronic Component
Minimum package
10000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
KOA
Electronic Component
RK73H1ETTP4991F
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.011g
Electronic Component
4.99kΩ
Electronic Component
1
Electronic Component
BM0265802634
Operating Temperature
55℃~+155℃
Operating Voltage
75V
Electronic Component
±100ppm/℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RK73H1ETTP4991F厚膜电阻产品概述

一、产品基本属性

RK73H1ETTP4991F是日本KOA公司推出的厚膜贴片电阻,采用行业通用的0402封装(公制尺寸1.0mm×0.5mm),属于小体积高密度贴片元件。厚膜电阻通过丝网印刷将电阻浆料沉积在陶瓷基底上,经高温烧结形成电阻体,兼具成本优势与性能稳定性,是电子电路中最常用的电阻类型之一。

该产品型号命名遵循KOA标准规则:

  • “RK73H”代表厚膜贴片电阻系列;
  • “1ETTP”为封装与性能标识;
  • “4991”对应阻值(前三位有效数字499,第四位倍率10¹,即4.99kΩ);
  • “F”表示精度等级±1%。

二、核心电气性能参数

1. 阻值与精度

标称阻值为4.99kΩ,精度达±1%,满足多数精密电路对电阻值的控制要求——无需额外筛选即可用于信号调理、分压、限流等场景,避免因阻值偏差导致的电路性能波动。

2. 功率与电压

  • 额定功率:100mW(1/10W),适配0402封装的典型功率需求;
  • 最大工作电压:75V(直流或交流有效值),电压峰值不得超过该值,可有效避免电阻击穿或过热失效。

3. 温度系数(TCR)

温度系数为**±100ppm/℃**,表示温度每变化1℃,阻值变化量为标称值的百万分之一百。例如,当温度从25℃升至125℃(温差100℃),阻值变化约±0.499Ω,宽温环境下仍能保持性能稳定。

三、环境与温度适应性

该产品的工作温度范围为-55℃至+155℃,覆盖了极端低温(如户外低温环境)到高温(如功率器件附近热环境)的广泛场景,符合工业级电子元件的温度要求。

厚膜电阻的陶瓷基底具有良好热稳定性,配合KOA浆料配方优化,使得产品在宽温范围内阻值漂移得到有效控制,同时具备抗潮湿、抗机械应力能力,适合复杂环境下长期稳定工作。

四、典型应用场景

由于0402封装的小体积、1/10W功率适配性,以及±1%精度的实用价值,RK73H1ETTP4991F广泛应用于:

  1. 消费电子:智能手机、智能穿戴设备的信号调理(音频滤波、传感器放大)、电源分压(电池电量检测);
  2. 工业控制:PLC、传感器模块、小型电机驱动电路的限流、分压元件;
  3. 通信设备:路由器、交换机的匹配网络、信号衰减电路;
  4. 医疗电子:血糖仪、血压计等小型仪器的信号处理电路;
  5. 汽车电子(辅助级):车载信息娱乐系统、车身控制模块的低功率信号电路(需确认汽车级认证后适用)。

五、可靠性与选型优势

  1. 品牌可靠性:KOA拥有70余年电阻生产经验,产品符合JIS、IEC等国际标准,精度控制、一致性、长期稳定性经过严格测试,降低批量生产故障率;
  2. 性能适配性:参数(0402封装、1/10W、±1%、±100ppm/℃)精准匹配中小功率、小体积、中等精度需求,避免过度选型导致成本上升;
  3. 成本效益:厚膜技术成熟,在保证性能的前提下具备良好成本竞争力,适合大规模量产;
  4. 生产兼容性:0402封装兼容主流贴片贴装设备,可实现高速自动化生产,提高效率。

该产品凭借稳定的性能、适配的参数与可靠的品牌背书,成为电子电路设计中高性价比的厚膜电阻选型之一。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.