WMSIC Electronic Components

KOA RK73H1JTTD2203F

ModelRK73H1JTTD2203F
Package0603
BrandKOA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
KOA RK73H1JTTD2203F
Type
KOA
Unit
Electronic Component
Minimum package
5000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
KOA
Electronic Component
RK73H1JTTD2203F
Electronic Component
1
Package
0603
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.023g
Electronic Component
220kΩ
Electronic Component
1
Electronic Component
BM0265375394
Operating Temperature
55℃~+155℃
Operating Voltage
75V
Electronic Component
±100ppm/℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RK73H1JTTD2203F 厚膜贴片电阻产品概述

一、产品核心定位与目标场景

RK73H1JTTD2203F是日本KOA公司推出的高性价比厚膜贴片电阻,主打“常规精度+小型化+宽温适应”,针对消费电子、工业控制、通信设备等领域的基础电路设计。无需依赖高精度薄膜电阻即可满足大多数电路的阻值偏差需求,同时兼顾成本控制与可靠性,是中小功率电路的通用选型。

二、关键参数与性能解析

该电阻的核心参数清晰明确,可直接支撑常规电路设计:

  • 阻值与精度:220kΩ(标识代码“2203”),精度±1%——满足99%以上常规电路(如分压、限流、滤波)的偏差要求,无需额外校准;
  • 功率与电压:额定功率100mW,最大工作电压75V——适用于低功耗场景(如手机电源管理、小型传感器信号调理),使用注意:125℃以上需降额至50mW以内(参考KOA降额曲线);
  • 温度特性:温度系数±100ppm/℃,工作温度-55℃+155℃——温度每变化1℃,阻值波动约0.01%;宽温范围覆盖工业现场(-40℃85℃)、户外设备等场景;
  • 工艺优势:厚膜电阻(丝网印刷+烧结工艺)——相比薄膜电阻成本低30%以上,长期稳定性优(1000小时阻值漂移<0.5%)。

三、封装与物理特性

采用0603封装(英制,对应公制1608尺寸),具体规格:

  • 长1.6±0.15mm、宽0.8±0.15mm、高0.45±0.1mm;
  • 小尺寸适配高密度贴片安装(如智能手机主板、IoT模块),兼容常规SMT生产线(回流焊/波峰焊均可),无引脚设计减少焊接缺陷,提升生产良率。

四、可靠性与环境适应性

KOA的厚膜工艺保障了该电阻的工业级可靠性:

  • 宽温稳定性:-55℃~155℃范围内阻值变化符合规格,无明显漂移;
  • 抗冲击性:可承受1500g/0.5ms机械冲击,适应运输、安装中的振动场景;
  • 环保合规:符合RoHS 2.0、REACH标准,无铅镀层(Sn/Pb或纯Sn),满足全球市场准入。

五、品牌与工艺优势

作为KOA成熟产品线,该电阻具备:

  • 参数一致性:批量生产时阻值偏差、温度系数波动极小(±0.1%以内),避免电路性能差异;
  • 供货稳定:全球供应链成熟,常规型号库存充足,交货周期1-2周;
  • 应用支持:提供详细手册(含降额曲线、焊接参数),帮助工程师快速选型。

六、典型应用场景示例

该电阻广泛用于以下场景:

  1. 消费电子:智能手机电池电压分压检测、蓝牙耳机信号滤波;
  2. 工业控制:小型PLC I/O口限流、温度传感器分压电路;
  3. 通信设备:WiFi模块射频匹配网络、基站辅助电路限流;
  4. 汽车电子:车载USB过流保护限流、仪表盘背光分压。

综上,RK73H1JTTD2203F是一款“性能够用、成本可控、可靠性强”的通用厚膜贴片电阻,适合大多数常规电子电路的基础应用。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.