WMSIC Electronic Components

KOA RK73B1ERTTP103J

ModelRK73B1ERTTP103J
Package0402
BrandKOA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
KOA RK73B1ERTTP103J
Type
KOA
Unit
Electronic Component
Minimum package
10000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
KOA
Electronic Component
RK73B1ERTTP103J
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±5%
Electronic Component
0.011g
Electronic Component
10kΩ
Electronic Component
1
Electronic Component
BM0265983499
Operating Temperature
55℃~+155℃
Operating Voltage
75V
Electronic Component
±200ppm/℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

KOA RK73B1ERTTP103J 厚膜贴片电阻产品概述

RK73B1ERTTP103J是日本KOA公司推出的通用型厚膜贴片电阻,采用0402小型封装,专为高密度、宽温适应性电路设计,广泛应用于消费电子、工业控制等领域。以下从核心属性、参数、应用等维度详细介绍该产品。

一、产品定位与核心标识

该电阻属于KOA RK73系列,定位为低成本高可靠的小型化元件,兼顾性能与成本,适合批量应用于对空间要求严格、温度范围较宽的电路中。型号编码解析清晰:

  • RK73:厚膜贴片电阻系列标识;
  • B:封装代码(对应0402英制封装);
  • 103:阻值编码(10×10³=10kΩ);
  • J:精度标识(±5%通用精度档)。

二、核心电气参数详解

关键参数经过严格测试,满足工业级应用需求,核心指标如下:

1. 阻值与精度

阻值为10kΩ,精度等级**±5%(J档)**,属于通用精度级别,可满足大多数模拟/数字电路的信号调节、分压、限流等基础需求,无需额外校准即可稳定工作。

2. 功率与电压

  • 额定功率:100mW(1/10W),适用于低功耗电路;实际使用建议采用50%降额(≤50mW),避免长期过热导致阻值漂移;
  • 额定工作电压:75V,即电路中施加的直流/交流电压不超过75V时,电阻性能稳定,无击穿或参数衰减风险。

3. 温度特性

  • 工作温度范围:-55℃~+155℃,覆盖工业级环境(如车间、户外设备)和汽车电子的高低温场景;
  • 温度系数(TCR):±200ppm/℃,表示每变化1℃,阻值变化百万分之200。例如,在-55℃至155℃的极端温差下(温差210℃),阻值最大变化量仅为4.2Ω,结合±5%精度(±500Ω),总误差仍在工程可接受范围内。

三、封装与工艺优势

该电阻采用0402封装(英制尺寸:0.04英寸×0.02英寸,公制:1.0mm×0.5mm),是小型化电子设备的常用封装,可显著节省PCB空间,提升电路集成度。

采用厚膜工艺(陶瓷基底+电阻浆料烧结),相比薄膜电阻具备以下优势:

  • 成本更低,适合大规模量产;
  • 耐过载能力更强,短期脉冲电压下不易失效;
  • 阻值范围宽(覆盖1Ω~10MΩ),适配多种电路需求;
  • 符合RoHS无铅环保要求,焊接兼容性好(支持回流焊、波峰焊,需遵循IPC标准温度曲线)。

四、典型应用场景

RK73B1ERTTP103J的参数特性使其适配多个领域的电路设计:

1. 消费电子领域

  • 手机、平板电脑主板的信号滤波、按键电路限流;
  • 蓝牙耳机、智能手环的传感器接口分压(如心率传感器、加速度计);
  • 小型家电(智能插座、加湿器)的控制电路。

2. 工业控制领域

  • PLC(可编程逻辑控制器)的模拟量输入/输出接口电阻;
  • 工业传感器(温度、压力传感器)的信号调理电路;
  • 电机驱动模块的电流检测限流电阻。

3. 汽车电子领域

  • 汽车辅助系统(胎压监测、倒车雷达)的传感器信号分压;
  • 车载信息娱乐系统的小信号电路。

五、选型优势与注意事项

选型优势

  1. 成本效益:厚膜工艺降低制造成本,适合中低端批量应用;
  2. 小型化适配:0402封装满足高密度PCB设计需求;
  3. 宽温稳定:-55℃~155℃温度范围覆盖多数工业/汽车场景;
  4. 品牌可靠性:KOA作为专业电阻厂商,产品一致性好,故障率低。

注意事项

  1. 功率降额:实际功率需控制在50mW以内,避免长期过热;
  2. 电压限制:电路电压不超过75V额定值,防止击穿;
  3. 焊接规范:回流焊温度需符合IPC J-STD-020标准,避免陶瓷基底开裂;
  4. 精度匹配:若电路需要更高精度(如1%、0.1%),需选择对应精度型号,本型号仅适配±5%需求。

综上,RK73B1ERTTP103J是一款性价比突出的通用厚膜贴片电阻,可满足多数小型化、宽温电子设备的基础电阻需求,是工程师选型的可靠选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.