WMSIC Electronic Components

KOA RK73H1ETTP3001F

ModelRK73H1ETTP3001F
Package0402
BrandKOA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
KOA RK73H1ETTP3001F
Type
KOA
Unit
Electronic Component
Minimum package
10000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
KOA
Electronic Component
RK73H1ETTP3001F
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.011g
Electronic Component
3kΩ
Electronic Component
1
Electronic Component
BM0265637152
Operating Temperature
55℃~+155℃
Operating Voltage
75V
Electronic Component
±100ppm/℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RK73H1ETTP3001F 厚膜电阻产品概述

一、产品基本身份与定位

RK73H1ETTP3001F是日本KOA品牌推出的表面贴装厚膜电阻,属于该品牌常规精度系列中的小功率产品。型号命名遵循行业通用逻辑:

  • “RK73H”为系列标识(代表0402封装厚膜电阻);
  • “1ETTP”为特性代码(含精度、功率等核心参数);
  • “3001”对应阻值3kΩ(前三位300为有效数字,第四位1代表×10¹);
  • “F”为精度代码(±1%)。

该产品定位为高密度电路设计中的通用电阻,兼顾小型化、稳定性与成本优势,广泛适配消费电子、工业控制等多领域。

二、核心电气参数详解

产品电气参数精准覆盖大多数中低端电路需求,关键参数及意义如下:

  1. 阻值与精度:标称3kΩ,精度±1%(F级)——满足工业级电路对阻值一致性的基本要求,无需额外校准即可用于分压、限流等基础电路;
  2. 功率额定值:100mW(1/10W)——与0402封装功率容量匹配,适合低功耗场景(如传感器接口、信号调理);
  3. 工作电压:75V(直流/交流峰值)——额定电压需严格遵守,避免过压导致厚膜层击穿;
  4. 温度系数(TCR):±100ppm/℃——温度每变化1℃,阻值变化±0.01%;若环境温差100℃(如-55℃→+45℃),阻值变化仅±0.1%,稳定性优于普通碳膜电阻;
  5. 工作温度范围:-55℃+155℃——覆盖工业级(-40℃+85℃)与部分高温场景(如烤箱内温度传感器电路)。

三、封装与物理特性

采用0402封装(公制1005,即1.0mm×0.5mm),是小尺寸表面贴装电阻的典型规格:

  • 尺寸细节:长度1.0±0.2mm,宽度0.5±0.2mm,厚度0.35±0.05mm(含电极);
  • 电极设计:镍-金(Ni/Au)或镍-锡(Ni/Sn)电极,兼容无铅焊接(符合RoHS标准);
  • 结构优势:陶瓷基底+厚膜电阻浆料烧结而成,抗冲击、抗振动,适合便携式设备移动场景。

四、环境适应性与可靠性

产品可靠性针对实际场景优化:

  • 宽温适应性:-55℃~+155℃覆盖户外设备(如太阳能路灯控制器)、工业高温模块需求;
  • 耐湿耐腐蚀:环氧树脂封装抵抗湿气与腐蚀性气体(SO₂、H₂S),干燥环境下存储期12个月;
  • 机械可靠性:符合IEC 60068-2-6(振动)与IEC 60068-2-27(冲击)标准,可承受10g振动(20~2000Hz)、1000m/s²冲击,适配车载仪表盘等振动场景。

五、典型应用场景

因尺寸小、性能稳定,广泛用于:

  1. 消费电子:智能手机电源分压电路、平板电脑触控传感器接口、蓝牙耳机充电管理模块;
  2. 工业控制:PLC信号调理电路、小型电机驱动限流电阻、温度传感器信号转换电路;
  3. 可穿戴设备:智能手表心率传感器电路、手环电池保护电路(压缩产品体积);
  4. 通信设备:小型基站射频前端偏置电路、路由器LED指示灯限流电阻。

六、选型与使用注意事项

为确保性能与寿命,需注意:

  1. 功率降额:实际功率不超额定值80%(80mW),避免长期过载导致阻值漂移(降额可延长寿命3~5倍);
  2. 焊接工艺:回流焊峰值温度240℃±5℃(时间≤10秒),波峰焊底部温度≤220℃(氮气保护),防止封装开裂;
  3. 存储条件:未开封产品存于1535℃、4060%RH环境,开封后1个月内使用完毕(避免电极氧化);
  4. 电路匹配:高压场景(接近75V)需确认PCB绝缘距离,防止爬电。

该产品凭借小尺寸、稳定性能与高性价比,成为高密度电路设计的常用选型之一。

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