Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
RK73H1ETTP40R2F是KOA品牌针对中小功率高密度电路设计的厚膜电阻器,核心参数聚焦阻值精度、功率容量与环境适应性,具体如下:
±1%的精度等级可避免电路因阻值偏差导致的信号失真或功率分配不均。例如在分压电路中,该精度能将输出电压偏差控制在0.4Ω以内(40.2Ω×1%),无需额外校准即可满足基本性能要求。
100mW额定功率适配低功耗设备(如智能穿戴、小型传感器),75V最大电压覆盖多数中小信号电路的电压上限。实际应用需遵循降额规范:环境温度超过70℃时,功率需按曲线递减(如125℃时降额至50mW),避免过热失效。
±100ppm/℃的温度系数意味着阻值随温度变化的幅度可控:以25℃为基准,温度升至155℃(变化130℃)时,阻值变化约0.52Ω(40.2Ω×0.0001×130),总波动范围39.68Ω~40.72Ω,满足宽温环境下的性能稳定需求。
该电阻采用0402封装(英制尺寸,对应公制1005),体积小巧(长1.0mm×宽0.5mm),可大幅缩小PCB布局面积,适配手机、智能手表等小型化设备。
厚膜电阻的结构设计(陶瓷基底+厚膜电阻浆料)兼顾成本与性能:
-55℃至+155℃的工作温度覆盖工业级、部分汽车电子场景(如户外传感器、车载辅助系统),厚膜陶瓷基底具有良好的热稳定性,长期工作阻值漂移小。
陶瓷基底耐湿性、耐腐蚀性优于普通电阻,可在高湿度(如浴室、户外设备)或轻微腐蚀性环境下稳定工作。存储条件建议为-40℃~+85℃、湿度≤85%,避免极端环境下的性能退化。
基于参数与封装优势,该电阻适用于以下领域:
RK73H1ETTP40R2F是一款高性价比厚膜电阻,平衡了精度、功率、温度稳定性与成本,适配多领域中小功率电路需求,是批量应用的理想选择。其0402封装与宽温特性,尤其适合小型化、宽温环境的设备设计。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products