WMSIC Electronic Components

KOA SG73P1EWTTP1002F

ModelSG73P1EWTTP1002F
Package0402
BrandKOA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
KOA SG73P1EWTTP1002F
Type
KOA
Unit
Electronic Component
Minimum package
10000 圆盘

Technical parameters

Power
250mW
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
KOA
Electronic Component
SG73P1EWTTP1002F
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.011g
Electronic Component
10kΩ
Electronic Component
1
Electronic Component
BM0265802626
Operating Temperature
55℃~+155℃
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SG73P1EWTTP1002F 厚膜电阻产品概述

一、产品核心身份与型号关联

SG73P1EWTTP1002F是KOA品牌旗下的通用厚膜贴片电阻,型号编码直接映射核心参数:

  • 阻值编码「1002」:前两位为有效数字(10),后两位为倍率(10²),对应固定阻值10kΩ;
  • 精度等级:通过型号隐含的「1%」标识,明确阻值偏差为±1%;
  • 功率与封装:「1/4W(250mW)」为额定功率,「0402」为英制封装(公制1005,尺寸1.0mm×0.5mm)。
    该型号属于KOA常规厚膜电阻系列,针对中小功率、宽温环境的通用场景优化设计。

二、关键性能参数及实际意义

1. 阻值与精度

固定阻值10kΩ,±1%精度满足大多数电路的信号调理需求:

  • 例如在传感器信号放大电路中,±1%精度可避免额外校准,保证输出线性度偏差≤1%;
  • 10kΩ阻值是分压、滤波、上拉/下拉网络的常用值,兼容性强。

2. 功率与负载能力

额定功率250mW(1/4W),是0402封装的主流功率等级,负载余量充足:

  • 以12V电源为例,10kΩ电阻功耗为14.4mW(12²/10k),仅为额定功率的5.76%,可长期稳定运行;
  • 适合低功耗电路(如IoT终端、消费电子),无需降额使用。

3. 温度系数(TCR)与宽温稳定性

±100ppm/℃的温度系数,意味着温度每变化1℃,阻值变化±0.01%:

  • 当工作温度从-55℃升至+155℃(变化210℃),阻值变化约±2.1%,结合初始精度±1%,总误差≤±3.1%;
  • 完美适配汽车发动机舱(-40℃125℃)、户外工业传感器(-30℃85℃)等宽温场景。

4. 工作温度范围

-55℃~+155℃的宽温范围,覆盖了车载、工业、户外等严苛环境,无需额外防护设计。

三、封装与工艺优势

1. 0402封装特性

  • 尺寸紧凑(长1.0mm×宽0.5mm×高0.35mm),适合高密度PCB设计(如智能手机主板、小型PLC模块);
  • 贴片式结构支持自动化贴装,生产效率高,组装成本低。

2. 厚膜工艺优势

相比薄膜电阻(成本高)、线绕电阻(体积大),厚膜工艺平衡了成本、体积与稳定性:

  • 抗冲击、抗振动能力强,适合车载、工业等振动环境;
  • 一致性好,批量生产时阻值偏差控制精准。

四、典型应用场景匹配

1. 汽车电子

  • 车载传感器(温度、压力、位置传感器)的信号调理电路;
  • 仪表盘背光控制、车载WiFi模块的阻抗匹配。

2. 消费电子

  • 智能手机/平板的音频滤波、充电保护电路;
  • 智能手表的传感器接口、低功耗蓝牙模块的分压网络。

3. 工业控制

  • PLC输入输出模块的上拉/下拉电阻;
  • 小型电机驱动电路的限流电阻、工业传感器的信号放大电路。

4. 智能家居

  • 智能门锁的指纹传感器接口;
  • 智能音箱的音频信号调理、WiFi模块的阻抗匹配。

五、品牌可靠性与合规性

KOA作为全球被动元器件龙头,该型号经过严格可靠性测试:

  • 高温老化(155℃×1000小时):阻值变化≤0.5%;
  • 温度循环(-55℃~+155℃×500次):无开路/短路故障;
  • 符合RoHS 2.0、REACH等环保指令,满足全球市场合规要求。

六、选型拓展参考

若需调整参数,可参考同品牌系列:

  • 更高精度(±0.5%):选SG73P1EWTTP1002G;
  • 更高功率(1/2W):切换0603封装的SG73P2EWTTP1002F;
  • 更低温度系数(±50ppm/℃):选KOA薄膜电阻RN系列。

但SG73P1EWTTP1002F在「小封装+宽温+通用精度」的平衡上具有明显优势,是常规电路设计的高性价比选择。

该产品凭借稳定的性能、紧凑的封装与可靠的品牌背书,广泛适配汽车、消费电子、工业等多领域的通用电路需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.