WMSIC Electronic Components

KOA RK73H1ETTP5622F

ModelRK73H1ETTP5622F
Package402
BrandKOA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
KOA RK73H1ETTP5622F
Type
KOA
Minimum package
10000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
KOA
Electronic Component
RK73H1ETTP5622F
Electronic Component
1
Package
402
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.011g
Electronic Component
56.2kΩ
Electronic Component
1
Electronic Component
BM0264574376
Operating Temperature
55℃~+155℃
Electronic Component
±100ppm/℃
Resistor Type
Resistor
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RK73H1ETTP5622F 厚膜芯片电阻产品概述

一、产品定位与核心价值

RK73H1ETTP5622F是KOA推出的汽车级厚膜芯片电阻,针对严苛环境下的小信号电路设计,平衡了精度、可靠性与成本优势。产品以AEC-Q200认证为核心保障,适配汽车电子、工业控制等对稳定性要求高的场景,同时凭借小封装(0402)满足高密度PCB设计需求。

二、关键性能参数详解

1. 阻值与精度

额定阻值为56.2kΩ,精度±1%——该规格覆盖80%以上工业/汽车常规信号调理需求,无需额外校准即可保证电路输出一致性,尤其适合传感器分压、偏置电路等对精度敏感的应用。

2. 功率与温度特性

  • 功率规格:100mW(0.1W),适配小信号电路(如传感器输出、模拟放大电路),避免功率冗余导致的体积浪费;
  • 温度系数:±100ppm/℃,意味着温度变化100℃时阻值漂移仅0.01%,结合**-55℃~+155℃宽工作温度范围**,可稳定工作于汽车发动机舱(高温)、工业低温车间等极端环境。

3. 封装与尺寸

采用0402封装(公制1005),体积仅1.0mm×0.5mm,适合车载信息娱乐系统、PLC模块等对PCB空间要求严格的场景,可有效提升电路集成度。

三、可靠性与环境适应性设计

1. 汽车级认证保障

通过AEC-Q200认证,满足汽车电子严苛的可靠性测试要求:

  • 温度循环(-40℃~125℃,1000次);
  • 湿度偏压(85℃/85%RH,1000h);
  • 振动冲击(10g/2000Hz);
    确保产品在汽车全生命周期(10年以上)内性能稳定。

2. 防潮与厚膜工艺优势

  • 防潮设计:表面采用特殊涂层处理,减少湿度对厚膜层的侵蚀,适合沿海地区、潮湿工业环境应用;
  • 厚膜工艺:相比碳膜电阻精度更高(±1%),相比薄膜电阻成本更低,兼具稳定性与性价比。

四、典型应用场景

1. 汽车电子领域

  • 发动机ECU:信号分压网络、传感器偏置电路;
  • 车载传感器:压力、氧传感器的信号调理(如将05V输出分压至03.3V适配MCU);
  • 车身控制模块:灯光驱动的限流电阻、门锁电路的分压反馈。

2. 工业控制领域

  • PLC输入输出模块:数字信号滤波、模拟信号分压;
  • 电机驱动反馈:电流采样电路的基准电阻;
  • 工业传感器:称重、液位传感器的信号放大偏置。

3. 小型医疗/消费电子

  • 便携式医疗设备:血糖仪、血压计的信号处理电路;
  • 智能家居:温湿度传感器接口的限流/分压。

五、品牌与品质保障

KOA作为全球被动元件龙头厂商,RK73H1ETTP5622F具备以下品质优势:

  • 批量一致性:阻值偏差控制在±1%内,避免批次差异;
  • 环保合规:符合RoHS无铅无卤标准,适配全球市场;
  • 供应稳定:全球产能布局完善,可满足汽车、工业领域的批量采购需求。

RK73H1ETTP5622F以“高可靠+宽温+小封装”为核心竞争力,是汽车电子、工业控制等场景中小信号电路的优选电阻方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.