WMSIC Electronic Components

KOA RK73H1JTTD1000F

ModelRK73H1JTTD1000F
Package0603
BrandKOA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
KOA RK73H1JTTD1000F
Type
KOA
Unit
Electronic Component
Minimum package
5000 圆盘

Technical parameters

Power
125mW
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
KOA
Electronic Component
RK73H1JTTD1000F
Electronic Component
1
Package
0603
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.023g
Electronic Component
100Ω
Electronic Component
1
Electronic Component
BM0264517939
Operating Temperature
55℃~+155℃
Operating Voltage
75V
Electronic Component
±100ppm/℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RK73H1JTTD1000F厚膜贴片电阻产品概述

一、产品基本信息

RK73H1JTTD1000F是KOA株式会社推出的经典厚膜贴片电阻,属于RK73系列小型化电阻产品。该电阻采用0603封装(英制) ,对应公制尺寸1608,核心参数为:标称阻值100Ω、精度±1%、额定功率125mW,专为高密度、低功耗电子电路设计,适配多场景稳定使用需求。

二、核心技术参数

RK73H1JTTD1000F的关键参数经过严格校准,满足不同环境下的性能要求:

  • 阻值与精度:标称阻值100Ω,精度等级±1%,可避免因阻值偏差导致的信号失真或功率损耗异常,适配普通精密电路的阻值匹配;
  • 功率与电压:25℃环境下额定功率125mW,最大工作电压75V(经计算:75V×75V/100Ω=56.25mW≤125mW,符合功率额定值);
  • 温度系数:±100ppm/℃,即温度每变化1℃,阻值变化±0.01%,宽温范围内保持阻值稳定性;
  • 工作温度范围:-55℃至+155℃,覆盖工业级、汽车级等高低温场景的使用需求。

三、封装与尺寸规格

该电阻采用0603贴片封装,具体尺寸(公制)为:

  • 长度:1.6mm±0.15mm
  • 宽度:0.8mm±0.15mm
  • 厚度:0.45mm±0.05mm
  • 焊盘间距:约1.2mm

小尺寸设计适配高密度PCB布局,支持自动化贴装生产,有效降低电路空间占用,适合便携式设备、小型模块等对尺寸敏感的应用。

四、典型应用场景

RK73H1JTTD1000F凭借小封装、宽温工作及稳定性能,适用于以下场景:

  1. 消费电子:智能手机、平板电脑、智能穿戴设备的电源滤波、信号分压电路;
  2. 工业控制:小型传感器(温度、压力传感器)的信号调理电路,PLC模块辅助电路;
  3. 汽车电子:车载低功耗模块(胎压监测、座椅传感器)的辅助电路(工作温度覆盖汽车舱内高低温);
  4. 通信设备:小型基站、路由器的信号处理电路,无线模块的阻抗匹配。

五、性能优势

  1. 宽温稳定性:±100ppm/℃温度系数及-55℃~+155℃工作范围,极端环境下阻值偏差小,电路性能稳定;
  2. 小封装高密度:0603封装提升电路集成度,降低产品体积,适配便携式设备设计;
  3. 成本与性能平衡:厚膜工艺兼顾性能与成本,满足中高端电子设备的性价比需求;
  4. 品牌可靠性:KOA作为全球知名电阻制造商,产品经温度循环、湿度测试等严格可靠性验证,故障率低。

六、可靠性与环境适应性

  1. 环保合规:符合RoHS 2.0、REACH标准,无铅无卤素,适配绿色电子产品设计;
  2. 耐环境性能:厚膜电阻结构抗湿、抗弱腐蚀能力优于薄膜电阻,可在潮湿、工业环境下长期工作;
  3. 功率降额:25℃以上需按降额曲线使用(如125℃时额定功率约为25℃的50%),确保长期可靠性。

该产品以稳定性能、小尺寸及高性价比,成为消费电子、工业控制等领域的常用电阻选型之一。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.