WMSIC Electronic Components

KOA RK73B1JTTD131J

ModelRK73B1JTTD131J
Package0603
BrandKOA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
KOA RK73B1JTTD131J
Type
KOA
Unit
Electronic Component
Minimum package
5000 圆盘

Technical parameters

Power
125mW
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
KOA
Electronic Component
RK73B1JTTD131J
Electronic Component
1
Package
0603
Electronic Component
SMD Resistor
Electronic Component
±5%
Electronic Component
0.023g
Electronic Component
130Ω
Electronic Component
1
Electronic Component
BM0264770986
Operating Temperature
55℃~+155℃
Operating Voltage
75V
Electronic Component
±200ppm/℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RK73B1JTTD131J厚膜电阻产品概述

一、产品核心定位与品牌背景

RK73B1JTTD131J是日本KOA株式会社推出的通用型厚膜固定电阻,属于RK73B系列核心型号。KOA作为全球被动元器件领域的老牌厂商,拥有70余年研发生产经验,其电阻产品以“稳定性强、一致性优、可靠性高”为核心优势,广泛覆盖消费电子、工业控制、汽车电子等多领域。该型号针对中小功率、小型化电路设计,兼顾性能与成本,是常规电子设计的高性价比优选组件。

二、关键电气与物理参数详解

该型号参数均符合KOA厚膜电阻的标准规格,各参数的实际意义与约束如下:

1. 阻值与精度

  • 标称阻值:130Ω(电阻体标识为“131”,即13×10¹Ω);
  • 精度等级:±5%,属于通用级精度,可满足大多数非高精度场景(如信号分压、电流限制),无需额外高精度成本。

2. 功率与电压约束

  • 额定功率:125mW(1/8W),是0603封装厚膜电阻的典型功率规格,适配中小电流电路;
  • 最大工作电压:75V,需注意实际工作时需同时满足三个约束:电压≤75V、功率≤125mW、电流≤P/R≈0.96mA(例如:75V工作时,功率仅为75²/130≈43mW,远低于额定值,安全可靠)。

3. 温度特性与工作范围

  • 温度系数(TCR):±200ppm/℃,表示温度每变化1℃,阻值偏差±200×10⁻⁶倍。以130Ω为例,100℃温度变化下阻值偏差约±2.6Ω,仍在±5%精度范围内;
  • 工作温度范围:-55℃~+155℃,宽温特性可适应工业户外设备、车载系统等环境的温度波动(远超常规民用级电阻-40℃~+85℃的范围)。

三、封装与工艺优势

1. 小型化封装

采用0603封装(英寸制,对应公制1608,尺寸:长1.6mm×宽0.8mm),体积紧凑,适配高密度PCB布局(如智能手机、可穿戴设备等便携产品),有效节省电路板空间。

2. 厚膜工艺特点

依托陶瓷基底厚膜烧结工艺:将电阻浆料丝网印刷在氧化铝陶瓷基底上,经高温烧结形成稳定电阻膜,再制作电极与封装。相比碳膜电阻,温度稳定性、抗湿性更强;相比薄膜电阻,成本更低,适合批量应用。

四、典型应用场景

RK73B1JTTD131J的参数特性使其适配多类通用电子场景:

  1. 消费电子:智能手机/平板的音频接口、按键电路、电池保护板电流检测电阻;
  2. 工业控制:PLC输入输出接口的下拉/上拉电阻、传感器信号调理电路(如温度传感器分压电阻);
  3. 汽车电子:车载娱乐系统辅助电路(如显示屏背光调节)、车身控制模块低压信号电阻(宽温特性适配车载环境);
  4. 通信设备:路由器/交换机的数字电路终端电阻、电源滤波电路限流电阻。

五、可靠性与环保特性

  1. 可靠性验证:KOA对该型号完成多项严格测试:
    • 温度循环测试(-55℃~+155℃,1000次循环,阻值变化≤±1%);
    • 湿度测试(85℃/85%RH,1000小时,阻值变化≤±2%);
    • 振动测试(10~2000Hz,2g加速度,3方向各2小时,无开路/短路);
  2. 环保兼容:符合RoHS 2.0、REACH等环保标准,支持无铅焊接工艺,适配现代电子制造流程。

总结

RK73B1JTTD131J作为KOA的通用型厚膜电阻,以130Ω±5%阻值、1/8W功率、0603小型封装为核心,兼顾宽温特性(-55~+155℃)与高可靠性,是消费电子、工业控制、汽车电子等领域中小功率电路的高性价比选择。其参数平衡了性能与成本,可满足大多数常规电子设计需求,同时适配高密度PCB布局与宽环境温度应用。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.