WMSIC Electronic Components

KOA RK73H1JTTD3092F

ModelRK73H1JTTD3092F
Package0603
BrandKOA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
KOA RK73H1JTTD3092F
Type
KOA
Minimum package
5000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
KOA
Electronic Component
RK73H1JTTD3092F
Electronic Component
1
Package
0603
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.023g
Electronic Component
30.9kΩ
Electronic Component
1
Electronic Component
BM0264738208
Operating Temperature
55℃~+155℃
Electronic Component
±100ppm/℃
Resistor Type
Resistor
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RK73H1JTTD3092F 厚膜芯片电阻产品概述

一、产品基本身份信息

RK73H1JTTD3092F是日本KOA公司推出的汽车级厚膜芯片电阻,属于专为严苛环境设计的小型化固定电阻。该型号采用标准0603封装(英制尺寸,对应公制1608规格),端子数为2,是汽车电子领域常用的高精度电阻器件。

二、核心电性能参数

1. 电阻值与精度

标称电阻为30.9 kΩ,容差±1%,属于高精度等级——这意味着在正常使用条件下,电阻值偏差不超过±309 Ω,能满足对信号稳定性要求较高的电路设计(如传感器信号调理)。

2. 功率特性

额定功率为0.1 W(即1/10 W),可支持常规低压电路的功率需求;若电路中瞬时功率接近额定值,需结合环境温度做降额设计(参考KOA官方降额曲线)。

3. 温度系数

温度系数为**±100 ppm/℃**,表示温度每变化1℃,电阻值变化约0.01%。该参数保证了在宽温度范围内,电阻值的相对稳定性,避免因温度波动导致电路性能漂移。

三、机械与尺寸规格

该电阻的机械尺寸严格符合0603封装标准:

  • 英制尺寸:长0.063"(≈1.60 mm)× 宽0.031"(≈0.80 mm);
  • 公制尺寸:1608(长1.6 mm × 宽0.8 mm);
  • 安装高度:最大值0.022"(≈0.55 mm),可适配高密度PCB布局,有效节省电路板空间,满足汽车电子小型化设计需求。

四、环境与可靠性特性

1. 汽车级认证

通过AEC-Q200标准认证,符合汽车电子行业的严苛可靠性要求(如振动、温度循环、湿度老化等测试),可直接用于汽车内外部各类电子系统。

2. 宽温工作范围

工作温度覆盖**-55℃ ~ 155℃**,能适应汽车使用环境中的极端温度(如冬季低温、发动机舱高温、夏季车内高温等)。

3. 防潮与厚膜工艺

  • 具备防潮特性,可抵御汽车内可能存在的水汽(如空调冷凝水、洗车环境),提升长期可靠性;
  • 采用厚膜电阻工艺,相比薄膜电阻具有更好的耐温性、抗冲击性和抗过载能力,适合汽车等对可靠性要求极高的领域。

五、典型应用场景

RK73H1JTTD3092F主要聚焦汽车电子领域,典型应用包括:

  • 汽车ECU(电子控制单元)内部的信号放大、滤波电路;
  • 车载传感器(温度、压力、位置传感器)的信号调理电路;
  • 车载通信模块(CAN/LIN总线)的阻抗匹配电路;
  • 汽车动力系统(发动机、变速箱控制)的辅助控制电路;
    此外,因宽温特性和高精度,也可用于工业控制中对温度、精度有要求的小型设备(如工业传感器信号处理)。

六、使用注意事项

  1. 功率降额:环境温度超过100℃时,需将额定功率降至原功率的50%以下(参考KOA datasheet);
  2. 焊接工艺:回流焊峰值温度不超过260℃,焊接时间不超过10秒;波峰焊时需控制浸锡深度(不超过引脚长度的2/3);
  3. 存储条件:存储环境需干燥(相对湿度≤60%)、温度0℃~40℃,避免长期暴露在高温高湿环境中。

该产品凭借高精度、宽温特性和汽车级可靠性,成为汽车电子及工业控制领域小型化电路设计的常用选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.